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Effect of composition and milling parameters on the critical ball milling of Ti–Si–B powders

The absence of brittle phases and elevated temperature during ball milling of a powder mixture containing a large amount of ductile component can contribute to reach an excessive agglomeration denoting a critical ball milling (CBM) behavior. This work reports in the effect of composition and milling...

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Bibliographic Details
Published in:Journal of alloys and compounds 2009-08, Vol.483 (1), p.190-194
Main Authors: Ramos, E.C.T., dos Santos, D.R., Cairo, C.A.A., Henriques, V.A.R., Ramos, A.S.
Format: Article
Language:English
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Summary:The absence of brittle phases and elevated temperature during ball milling of a powder mixture containing a large amount of ductile component can contribute to reach an excessive agglomeration denoting a critical ball milling (CBM) behavior. This work reports in the effect of composition and milling parameters on the CBM behavior of Ti–Si–B powders. High-purity elemental Ti–Si–B powder mixtures were processed in a planetary ball mill in order to prepare the Ti 6Si 2B compound and two-phase Ti + Ti 6Si 2B alloys. TiH 2 chips instead of titanium powder were used as a starting material. To avoid elevated temperature in the vials during ball milling of Ti–Si–B powders the process was interrupted after each 10 min followed by air-cooling. Following, the milled powders were hot-pressed at 900 °C for 1 h. Samples were characterized by X-ray diffraction (XRD), scanning electron microscopy (SEM), and energy dispersive spectrometry (EDS). Short milling times followed by air-cooling contributed to obtain a large amount of powders higher than 75% in the vials. Only Ti and TiH 2 peaks were observed in XRD patterns of Ti–Si–B and TiH 2–Si–B, respectively, suggesting that extended solid solutions were achieved. The large amount of Ti 6Si 2B and Ti + Ti 6Si 2B structures were formed during hot pressing from the mechanically alloyed Ti–Si–B and TiH 2–Si–B powders.
ISSN:0925-8388
1873-4669
DOI:10.1016/j.jallcom.2008.06.164