Failures of flip chip assemblies under thermal shock

Flip chip on board (FCOB) solder joint reliability under thermal shock stress was investigated. With underfill materials, the solder joint lifetime was increased from 37 to 1,300 2,480 cycles depending on the particular underfill material used. Through the use of CSAM, SEM, dye penetration tests and...

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Bibliographic Details
Published in:Soldering & surface mount technology 2003-12, Vol.15 (3), p.27-32
Main Authors: Bo, Cheng, Li, Wang, Qun, Zhang, Xia, Gao, Xiaoming, Xie, Kempe, Wolfgang
Format: Article
Language:English
Subjects:
Applied sciences
Crack initiation
Crack propagation
Design. Technologies. Operation analysis. Testing
Electronic equipment and fabrication. Passive components, printed wiring boards, connectics
Electronics
Exact sciences and technology
Experiments
Failure analysis
Failure mechanical
Fractures
Integrated circuits
Investigations
Lifetime
Microscopy
Morphology
Printed circuit boards
Printed circuits
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Solder
Soldering
Testing, measurement, noise and reliability
Thermal cycling
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Summary:Flip chip on board (FCOB) solder joint reliability under thermal shock stress was investigated. With underfill materials, the solder joint lifetime was increased from 37 to 1,300 2,480 cycles depending on the particular underfill material used. Through the use of CSAM, SEM, dye penetration tests and cross sectioning, the reliability of a FCOB assembly under thermal shock stress was evaluated. Both dye penetration and SEM fracture analysis can be used to measure quantitatively the extent of crack propagation for assemblies without underfill. A new failure mechanism, PCB cracking was also observed and discussed.
ISSN:0954-0911
1758-6836
DOI:10.1108/09540910310505099