Microelectronic Substrates for Optoelectronic Packages

Electronic systems with the increased functionality and speed required in today's advanced applications are placing a performance burden on the interconnection and packaging technologies that standard electrical 'wiring' approaches simply cannot support. Engineering staff at APL recog...

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Bibliographic Details
Published in:Johns Hopkins APL technical digest 2008-01, Vol.28 (1), p.40-46
Main Authors: Francomacaro, A Shaun, Wickenden, Dennis K, Lehtonen, S John, Tejada, Francisco
Format: Article
Language:English
Online Access:Get full text
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Summary:Electronic systems with the increased functionality and speed required in today's advanced applications are placing a performance burden on the interconnection and packaging technologies that standard electrical 'wiring' approaches simply cannot support. Engineering staff at APL recognized this trend several years ago, and in a collaborative effort with The Johns Hopkins University Department of Electrical and Computer Engineering, APL has been developing various microelectronic packages that support both electrical and optical signals and facilitate the translation between them. Work has begun to fabricate microelectronic substrates that use integrated optical waveguides to raise the level of the total system's performance as needed. This report will present some of the current technology for optoelectronic packages, an overview of the process technologies being developed industry-wide to meet the need, and details on related work within the Research and Technology Development Center and the Engineering Design, and Fabrication Branch of the Technical Services Department here at APL.
ISSN:0270-5214