Mechanical and Thermal Properties of Polymer Composites for Electronic Packaging Application

Alumina (AE) and mica (ME) particles were used as fillers in epoxy-based polymer composites. Comparisons were made between the composites with respect to mechanical, thermal, and morphological properties. Mechanical and thermal studies were performed on the composites at various filler contents. Dis...

Full description

Saved in:
Bibliographic Details
Published in:Journal of reinforced plastics and composites 2008-10, Vol.27 (15), p.1573-1584
Main Authors: Erfan Suryani Abdul Rashid, Ariffin, Kamarshah, Akil, Hazizan Md, Chee Choong Kooi
Format: Article
Language:English
Subjects:
Applied sciences
Composites
Exact sciences and technology
Forms of application and semi-finished materials
Polymer industry, paints, wood
Technology of polymers
Citations: Items that this one cites
Items that cite this one
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:Alumina (AE) and mica (ME) particles were used as fillers in epoxy-based polymer composites. Comparisons were made between the composites with respect to mechanical, thermal, and morphological properties. Mechanical and thermal studies were performed on the composites at various filler contents. Dispersion of the filler was evaluated using scanning electron micrograph (SEM). It was found that the flexural modulus of the composites was almost identical as far as AE and ME are concerned, particularly at 025 vol% of filler content. However, obvious increment was observed in the case of AE for flexural strength.
ISSN:0731-6844
1530-7964
DOI:10.1177/0731684407086328