A novel loading and demoulding process control in UV nanoimprint lithography

• Published in: Microelectronic engineering 2009, Vol.86 (1), p.4-9
• Main Authors: Liu, Hongzhong, Jiang, Weitao, Ding, Yucheng, Tang, Yiping, Lu, Bingheng, Lan, Hongbo, Shi, Yongsheng, Yin, Lei
• Format: Article
• Language: English
• Subjects: Applied sciences; Demoulding; Electronics; Exact sciences and technology; Loading; Micro/nanostructure; Microelectronic fabrication (materials and surfaces technology); Nanoimprint lithography (NIL) process; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
• ISSN: 0167-9317; 1873-5568
• DOI: 10.1016/j.mee.2008.08.012

In UV nanoimprint lithography (NIL) with elastic mould, a novel multi-step loading and demoulding process, called distortion reduction by pressure releasing (DRPR) and two-step curing method for demoulding, is developed. This novel imprint process is continuous, the pressure releasing method, used to optimize the loading process, can reduce the distortions of imprint mould and wafer stage, while obtain better cavity filling and thin and uniform residual layer; through two-step curing method instead of traditional simple demoulding, the curing degree of resist can be controlled, which is helpful to decrease the demoulding force and avoid residual layer pulled-up while ensure replicated protrusions not collapse. It is a novel and robust process with high fidelity of pattern replication in micro/nano structures fabrication, and the replication error caused by distortions and “blind” demoulding can be reduced effectively.