Loading…

Evaluation of the thermal creep behaviors and microstructure of Zircaloy-4 strip

The thermal creep behaviors and the microstructure characteristics for the crept specimens of Zircaloy-4 strip were investigated under a constant load stress in the temperature range of 350–450 °C and a stress range from 110 to 230 MPa. A microstructure evaluation was carried out for the specimens b...

Full description

Saved in:
Bibliographic Details
Published in:Nuclear engineering and design 2008-12, Vol.238 (12), p.3331-3335
Main Authors: Kim, Hyun Gil, Choi, Byoung Kwon, Jeong, Yong Hwan
Format: Article
Language:English
Subjects:
Citations: Items that this one cites
Items that cite this one
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:The thermal creep behaviors and the microstructure characteristics for the crept specimens of Zircaloy-4 strip were investigated under a constant load stress in the temperature range of 350–450 °C and a stress range from 110 to 230 MPa. A microstructure evaluation was carried out for the specimens before and after the creep test by using a TEM to understand the correlation between the creep mechanism and the microstructure. A variation of the crystal orientation with the creep deformation was investigated by using the electron back-scattered diffraction (EBSD) analysis. The stress exponent was in the range of 8–10 and the value of the stress exponent was varied by the applied stress. From the analysis of the stress exponent and a TEM microstructural observation of the crept specimens, the creep of Zircaloy-4 strip at a tested condition was mainly controlled by dislocations. From the EBSD results, it was observed that the crystal orientation in the crept sample strained about 10% was not changed as compared to the as-received sample.
ISSN:0029-5493
1872-759X
DOI:10.1016/j.nucengdes.2008.08.013