Buffer strips in composites at elevated temperature

The composite material 'buffer strip' concept is presently investigated at elevated temperatures for the case of graphite/polyimide buffer strip panels using a (45/0/45/90)2S layup, where the buffer strip material was 0-deg S-glass/polyimide. Each panel was loaded in tension until it faile...

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Bibliographic Details
Published in:Journal of composite materials 1983-11, Vol.17 (6), p.549-560
Main Author: Bigelow, C. A.
Format: Article
Language:English
Subjects:
Composite Materials
Exact sciences and technology
Fracture mechanics (crack, fatigue, damage...)
Fundamental areas of phenomenology (including applications)
Physics
Solid mechanics
Structural and continuum mechanics
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Summary:The composite material 'buffer strip' concept is presently investigated at elevated temperatures for the case of graphite/polyimide buffer strip panels using a (45/0/45/90)2S layup, where the buffer strip material was 0-deg S-glass/polyimide. Each panel was loaded in tension until it failed, and radiographs and crack opening displacements were recorded during the tests to determine fracture onset, fracture arrest, and the extent of damage in the buffer strip after crack arrest. At 177 + or - 3 C, the buffer strips increased the panel strength by at least 40 percent in comparison with panels without buffer strips. Compared to similar panels tested at room temperature, those tested at elevated temperature had lower residual strengths, but higher failure strains.
ISSN:0021-9983
1530-793X
DOI:10.1177/002199838301700607