Mechanically Flexible Chip-to-Substrate Optical Interconnections Using Optical Pillars

• Published in: IEEE transactions on advanced packaging 2008-02, Vol.31 (1), p.143-153
• Main Authors: Bakir, M.S., Glebov, A.L., Lee, M.G., Kohl, P.A., Meindl, J.D.
• Format: Article
• Language: English
• Subjects: Apertures; Applied sciences; Assembly; Chips; Circuit properties; compliant interconnects; Design. Technologies. Operation analysis. Testing; Efficiency; Electric, optical and optoelectronic circuits; Electronics; Exact sciences and technology; flip-chip; input/output (I/O); Integrated circuits; Integrated optics. Optical fibers and wave guides; integration; Interconnections; Joining; Light sources; Miscellaneous; Noise levels; Optical and optoelectronic circuits; Optical coupling; Optical interconnections; optical interconnects; Optical surface waves; Optical waveguides; Optoelectronic devices; packaging; Photodetectors; Pillars; polymers; Semiconductor device measurement; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices; Surface waves; Thermal expansion; waveguides
• ISSN: 1521-3323; 1557-9980
• DOI: 10.1109/TADVP.2007.914976

We experimentally characterize the benefits of using surface-normal mechanically flexible optical waveguides, or optical pillars, for chip-to-substrate optical interconnection. In order to benchmark the performance of the optical pillars, the optical coupling efficiency from a light source to an optical aperture with and without an optical pillar is measured. For a light source with 12deg beam divergence, a 50times150 mum optical pillar improves the coupling efficiency by 2-4 dB compared to pillar-free (free-space) optical coupling. A 30times150 m optical pillar improves the coupling efficiency by 3-4.5 dB. This demonstrates the importance of using optical pillars when small photodetectors (PDs) and dense optical input/outputs (I/Os) are needed. The optical excess losses of 50times150 mum optical pillars are measured to be less than 0.2 dB. Due to the high mechanical flexibility of the pillars, we also demonstrate that optical pillars enhance the optical coupling efficiency between the chip and substrate when they are misaligned in the lateral direction. This is especially important since the coefficient of thermal expansion of the chip and substrate are often mismatched, and preserving optical alignment and interconnection between them is critical during thermal excursions. The lateral mechanical compliance of the optical pillars is also measured and can be as great as 30 mum/mN. The optical pillars are also shown to be compliant under a compressive force thus allowing the optical I/Os to be assembled on nonplanar surfaces such as low-cost organic substrates.