Oxidization-Induced Tin Whisker Growth on the Surface of Sn-3.8Ag-0.7Cu-1.0Er Alloy

Rapid tin whisker growth has been found in Sn-3.8Ag-0.7Cu1.0Er solder joints. The morphology of the tin whiskers changes from rodlike to threadlike when the storage temperature increases from 25 °C to 150 °C. The compressive stress induced by the lattice expansion of the oxidized ErSn 3 phase provid...

Full description

Saved in:
Bibliographic Details
Published in:Metallurgical and materials transactions. A, Physical metallurgy and materials science Physical metallurgy and materials science, 2009-08, Vol.40 (8), p.2016-2021
Main Authors: Hao, Hu, Shi, Yaowu, Xia, Zhidong, Lei, Yongping, Guo, Fu
Format: Article
Language:English
Subjects:
Applied sciences
Atoms & subatomic particles
Characterization and Evaluation of Materials
Chemistry and Materials Science
Exact sciences and technology
Growth rate
Ion beams
Materials Science
Metallic Materials
Metals. Metallurgy
Nanotechnology
Scanning electron microscopy
Single crystals
Soldering
Structural Materials
Surface tension
Surfaces and Interfaces
Thin Films
Tin
Citations: Items that this one cites
Items that cite this one
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:Rapid tin whisker growth has been found in Sn-3.8Ag-0.7Cu1.0Er solder joints. The morphology of the tin whiskers changes from rodlike to threadlike when the storage temperature increases from 25 °C to 150 °C. The compressive stress induced by the lattice expansion of the oxidized ErSn 3 phase provides the driving force and the tin atoms released from the oxidization of the ErSn 3 phase provide the material source for the tin whisker growth.
ISSN:1073-5623
1543-1940
DOI:10.1007/s11661-009-9871-8