High-Speed Experimental Results for an Adhesive-Bonded Superconducting Multi-Chip Module

We report experimental results for chip-to-chip data communications on a superconducting Multi-Chip-Module (MCM) using a novel fabrication technique. The MCM was produced using a non-conductive adhesive to bond a 5-mm times 5-mm test chip to a 1-cm times 1-cm carrier. To our knowledge, this is the f...

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Bibliographic Details
Published in:IEEE transactions on applied superconductivity 2007-06, Vol.17 (2), p.971-974
Main Authors: Kaplan, S.B., Dotsenko, V., Tolpygo, D.
Format: Article
Language:English
Subjects:
Adhesive bonding
Applied sciences
Assembly
Bonding
Carriers
Chip-to-chip communications
Circuit stability
Circuit testing
cryogenic package
Cryogenic temperature
Cryogenics
Data communication
Design. Technologies. Operation analysis. Testing
Electrical engineering. Electrical power engineering
Electronics
Error analysis
Exact sciences and technology
Fabrication
Integrated circuits
Modules
multi-chip module
Nonconductive adhesives
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Solders
superconducting
Superconductivity
Temperature
Testing, measurement, noise and reliability
Testing. Reliability. Quality control
Thermal cycling
Thermal stability
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Summary:We report experimental results for chip-to-chip data communications on a superconducting Multi-Chip-Module (MCM) using a novel fabrication technique. The MCM was produced using a non-conductive adhesive to bond a 5-mm times 5-mm test chip to a 1-cm times 1-cm carrier. To our knowledge, this is the first time this technique was used for MCM assembly at cryogenic temperatures. The module demonstrated superior mechanical stability and protection from its environment during thermal cycling. The MCM also retained its electrical properties after multiple thermal cycling from room temperature to 4 K. We designed test circuits including various digital test benches, as well as analog test structures for bump characteristics. The superconducting circuitry successfully passed single-flux quanta at rates exceeding 50 Gbps. We measured error rates lower than 5 times 10 -14 at 36 Gbps using 100-micrometer- diameter In-Sn solder bumps, and lower than 6 times 10 -14 at 57 Gbps using 30-micrometer-diameter solder bumps.
ISSN:1051-8223
1558-2515
DOI:10.1109/TASC.2007.897376