Strengthening Materials by Engineering Coherent Internal Boundaries at the Nanoscale

Strengthening materials traditionally involves the controlled creation of internal defects and boundaries so as to obstruct dislocation motion. Such strategies invariably compromise ductility, the ability of the material to deform, stretch, or change shape permanently without breaking. Here, we outl...

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Bibliographic Details
Published in:Science (American Association for the Advancement of Science) 2009-04, Vol.324 (5925), p.349-352
Main Authors: Lu, K., Lu, L., Suresh, S.
Format: Article
Language:English
Subjects:
Alloys
Boundaries
Condensed matter: structure, mechanical and thermal properties
Crystal twinning
Defects and impurities in crystals
microstructure
Deformation
Deformation and plasticity (including yield, ductility, and superplasticity)
Ductility
Exact sciences and technology
Grain and twin boundaries
Grain size
Materials
Materials science
Mechanical and acoustical properties of condensed matter
Mechanical engineering
Mechanical properties of solids
Nanomaterials
Nanotechnology
Optimization
Physics
Plasticity
Review
Strain rate
Structure of solids and liquids
crystallography
Thin film deposition
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Summary:Strengthening materials traditionally involves the controlled creation of internal defects and boundaries so as to obstruct dislocation motion. Such strategies invariably compromise ductility, the ability of the material to deform, stretch, or change shape permanently without breaking. Here, we outline an approach to optimize strength and ductility by identifying three essential structural characteristics for boundaries: coherency with surrounding matrix, thermal and mechanical stability, and smallest feature size finer than 100 nanometers. We assess current understanding of strengthening and propose a methodology for engineering coherent, nanoscale internal boundaries, specifically those involving nanoscale twin boundaries. Additionally, we discuss perspectives on strengthening and preserving ductility, along with potential applications for improving failure tolerance, electrical conductivity, and resistance to electromigration.
ISSN:0036-8075
1095-9203
DOI:10.1126/science.1159610