Loading…
Electrodeposited Submicron Thermocouples with Microsecond Response Times
We describe a procedure for preparing submicron scale silver−nickel thermocouples (TCs) using electrochemical step edge decoration on graphite surfaces. Each fabrication operation produced ensembles of 2−20 TCs with diameters in the 1.0 μm to 500 nm range. These “sub-μm TCs” (SMTCs) produced linear...
Saved in:
Published in: | Nano letters 2007-10, Vol.7 (10), p.3208-3213 |
---|---|
Main Authors: | , , , |
Format: | Article |
Language: | English |
Subjects: | |
Citations: | Items that this one cites Items that cite this one |
Online Access: | Get full text |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Summary: | We describe a procedure for preparing submicron scale silver−nickel thermocouples (TCs) using electrochemical step edge decoration on graphite surfaces. Each fabrication operation produced ensembles of 2−20 TCs with diameters in the 1.0 μm to 500 nm range. These “sub-μm TCs” (SMTCs) produced linear voltage versus temperature output over the range from 20 to 100 °C characterized by a Seebeck coefficient of 20 ± 1 μV/°C, equal to the 21 μV/°C that is theoretically expected for a junction between these two metals. The time response of SMTCs was evaluated using two different laser-heating methods and compared with the smallest mechanically robust commercially available type J TCs. Electrochemical etching of the silver wire introduced constrictions at grain boundaries that reduced the thermal mass of the junction without altering its integrity or its overall diameter, producing a decrease of the measured rise time for SMTCs up to 96%. |
---|---|
ISSN: | 1530-6984 1530-6992 |
DOI: | 10.1021/nl071990q |