A Coupled Thermal-Mechanical Analysis of Ultrasonic Bonding Mechanism

A three-dimensional (3-D) finite element model has been developed to simulate the coupled thermal-mechanical fields in ultrasonic welding of aluminum foils. Transient distributions and evolution of the in-process variables, including normal stress, shear stress, slide distance, heat generation, temp...

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Bibliographic Details
Published in:Metallurgical and materials transactions. B, Process metallurgy and materials processing science Process metallurgy and materials processing science, 2009-04, Vol.40 (2), p.196-207
Main Authors: Zhang, Chunbo (SAM), Li, Leijun
Format: Article
Language:English
Subjects:
Applied sciences
Characterization and Evaluation of Materials
Chemistry and Materials Science
Exact sciences and technology
Materials Science
Metallic Materials
Metals. Metallurgy
Nanotechnology
Plastic deformation
Pressure
Production of metals
Simulation
Structural Materials
Surfaces and Interfaces
Temperature
Thin Films
Welding
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Summary:A three-dimensional (3-D) finite element model has been developed to simulate the coupled thermal-mechanical fields in ultrasonic welding of aluminum foils. Transient distributions and evolution of the in-process variables, including normal stress, shear stress, slide distance, heat generation, temperature, and plastic deformation on the contact interface, and their interactions have been studied in detail. The von Mises plastic strain from the simulation has been correlated with the measured bonded area of ultrasonic joints. A possible mechanism for ultrasonic bond formation is proposed. The severe, localized, plastic deformation at the bond region is believed to be the major phenomenon causing bond formation in ultrasonic welding.
ISSN:1073-5615
1543-1916
DOI:10.1007/s11663-008-9224-9