Design and Fabrication of Topologically Complex, Three-Dimensional Microstructures

Two concepts for use in the fabrication of three-dimensional (3D) microstructures with complex topologies are described. Both routes begin with a two-dimensional (2D) pattern and transform it into a 3D microstructure. The concepts are illustrated by use of soft lithographic techniques to transfer 2D...

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Bibliographic Details
Published in:Science (American Association for the Advancement of Science) 1998-06, Vol.280 (5372), p.2089-2091
Main Authors: Jackman, Rebecca J., Brittain, Scott T., Adams, Allan, Prentiss, Mara G., Whitesides, George M.
Format: Article
Language:English
Subjects:
Applied sciences
Axial strain
Cubes
Cylinders
Design
Electronics
Exact sciences and technology
Geometric planes
Lithography, masks and pattern transfer
Manufacturing
Materials science
Microelectronic fabrication (materials and surfaces technology)
Microstructure
Microstructures
Nanotechnology
Photoresists
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Silver
Symmetry
Three dimensional graphics
Titanium
Topology
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Summary:Two concepts for use in the fabrication of three-dimensional (3D) microstructures with complex topologies are described. Both routes begin with a two-dimensional (2D) pattern and transform it into a 3D microstructure. The concepts are illustrated by use of soft lithographic techniques to transfer 2D patterns to cylindrical (pseudo-3D) substrates. Subsequent steps-application of uniaxial strain, connection of patterns on intersecting surfaces-transform these patterns into free-standing, 3D, noncylindrically symmetrical microstructures. Microelectrodeposition provides an additive method that strengthens thin metal designs produced by patterning, welds nonconnected structures, and enables the high-strain deformations required in one method to be carried out successfully.
ISSN:0036-8075
1095-9203
DOI:10.1126/science.280.5372.2089