First- and second-level packaging for the IBM eServer z900

The system packaging of the processor cage for the IBM eServer z900 is described. This server contains the world's most complex multichip module, with a wiring length of one kilometer and a maximum power of 1300 W on a glass-ceramic substrate.

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Bibliographic Details
Published in:IBM journal of research and development 2002-07, Vol.46 (4.5), p.397-420
Main Authors: Harrer, H., Pross, H., Winkel, T.-M., Becker, W. D., Stoller, H. I., Yamamoto, M., Abe, S., Chamberlin, B. J., Katopis, G. A.
Format: Article
Language:English
Subjects:
CMOS
Computer architecture
Computer science
Design
Design engineering
Fourier transforms
Microprocessors
Package design
Packaging
Semiconductors
Servers
Systems design
Technology
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Description
Summary:The system packaging of the processor cage for the IBM eServer z900 is described. This server contains the world's most complex multichip module, with a wiring length of one kilometer and a maximum power of 1300 W on a glass-ceramic substrate.
ISSN:0018-8646
0018-8646
2151-8556
DOI:10.1147/rd.464.0397