Loading…
First- and second-level packaging for the IBM eServer z900
The system packaging of the processor cage for the IBM eServer z900 is described. This server contains the world's most complex multichip module, with a wiring length of one kilometer and a maximum power of 1300 W on a glass-ceramic substrate.
Saved in:
| Published in: | IBM journal of research and development 2002-07, Vol.46 (4.5), p.397-420 |
|---|---|
| Main Authors: | , , , , , , , , |
| Format: | Article |
| Language: | English |
| Subjects: | |
| Citations: | Items that cite this one |
| Online Access: | Get full text |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| cited_by | cdi_FETCH-LOGICAL-c290t-7e3fcc666b669110ec827c613e5b95ac2509d262f10671b2cfcddddcdc11eb843 |
|---|---|
| cites | |
| container_end_page | 420 |
| container_issue | 4.5 |
| container_start_page | 397 |
| container_title | IBM journal of research and development |
| container_volume | 46 |
| creator | Harrer, H. Pross, H. Winkel, T.-M. Becker, W. D. Stoller, H. I. Yamamoto, M. Abe, S. Chamberlin, B. J. Katopis, G. A. |
| description | The system packaging of the processor cage for the IBM eServer z900 is described. This server contains the world's most complex multichip module, with a wiring length of one kilometer and a maximum power of 1300 W on a glass-ceramic substrate. |
| doi_str_mv | 10.1147/rd.464.0397 |
| format | article |
| fullrecord | <record><control><sourceid>proquest_cross</sourceid><recordid>TN_cdi_proquest_miscellaneous_743207183</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>159248811</sourcerecordid><originalsourceid>FETCH-LOGICAL-c290t-7e3fcc666b669110ec827c613e5b95ac2509d262f10671b2cfcddddcdc11eb843</originalsourceid><addsrcrecordid>eNpdkD1PwzAURS0EEqUw8QcsFgaU8vwRO2GDikKlIgZgthz7paSkSbGTSvDrSVUGxFvuG46urg4h5wwmjEl9HfxEKjkBkesDMgJgWZIpqQ7__MfkJMYVAKRS5iNyM6tC7BJqG08jurbxSY1brOnGug-7rJolLdtAu3ek87snii8Ythjodw5wSo5KW0c8-80xeZvdv04fk8Xzw3x6u0gcz6FLNIrSOaVUoVTOGKDLuHaKCUyLPLWOp5B7rnjJQGlWcFc6P5zzjjEsMinG5HLfuwntZ4-xM-sqOqxr22DbR6Ol4KBZJgby4h-5avvQDOMM56BSmQk1QFd7yIU2xoCl2YRqbcOXYWB2Fk3wZrBodhbFDyiBYmw</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>220654836</pqid></control><display><type>article</type><title>First- and second-level packaging for the IBM eServer z900</title><source>IEEE Xplore All Journals</source><source>ABI/INFORM Global</source><creator>Harrer, H. ; Pross, H. ; Winkel, T.-M. ; Becker, W. D. ; Stoller, H. I. ; Yamamoto, M. ; Abe, S. ; Chamberlin, B. J. ; Katopis, G. A.</creator><creatorcontrib>Harrer, H. ; Pross, H. ; Winkel, T.-M. ; Becker, W. D. ; Stoller, H. I. ; Yamamoto, M. ; Abe, S. ; Chamberlin, B. J. ; Katopis, G. A.</creatorcontrib><description>The system packaging of the processor cage for the IBM eServer z900 is described. This server contains the world's most complex multichip module, with a wiring length of one kilometer and a maximum power of 1300 W on a glass-ceramic substrate.</description><identifier>ISSN: 0018-8646</identifier><identifier>EISSN: 0018-8646</identifier><identifier>EISSN: 2151-8556</identifier><identifier>DOI: 10.1147/rd.464.0397</identifier><identifier>CODEN: IBMJAE</identifier><language>eng</language><publisher>Armonk: International Business Machines Corporation</publisher><subject>CMOS ; Computer architecture ; Computer science ; Design ; Design engineering ; Fourier transforms ; Microprocessors ; Package design ; Packaging ; Semiconductors ; Servers ; Systems design ; Technology</subject><ispartof>IBM journal of research and development, 2002-07, Vol.46 (4.5), p.397-420</ispartof><rights>Copyright International Business Machines Corporation Jul/Sep 2002</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c290t-7e3fcc666b669110ec827c613e5b95ac2509d262f10671b2cfcddddcdc11eb843</citedby></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://www.proquest.com/docview/220654836/fulltextPDF?pq-origsite=primo$$EPDF$$P50$$Gproquest$$H</linktopdf><linktohtml>$$Uhttps://www.proquest.com/docview/220654836?pq-origsite=primo$$EHTML$$P50$$Gproquest$$H</linktohtml><link.rule.ids>314,780,784,11688,27924,27925,36060,36061,44363,74895</link.rule.ids></links><search><creatorcontrib>Harrer, H.</creatorcontrib><creatorcontrib>Pross, H.</creatorcontrib><creatorcontrib>Winkel, T.-M.</creatorcontrib><creatorcontrib>Becker, W. D.</creatorcontrib><creatorcontrib>Stoller, H. I.</creatorcontrib><creatorcontrib>Yamamoto, M.</creatorcontrib><creatorcontrib>Abe, S.</creatorcontrib><creatorcontrib>Chamberlin, B. J.</creatorcontrib><creatorcontrib>Katopis, G. A.</creatorcontrib><title>First- and second-level packaging for the IBM eServer z900</title><title>IBM journal of research and development</title><description>The system packaging of the processor cage for the IBM eServer z900 is described. This server contains the world's most complex multichip module, with a wiring length of one kilometer and a maximum power of 1300 W on a glass-ceramic substrate.</description><subject>CMOS</subject><subject>Computer architecture</subject><subject>Computer science</subject><subject>Design</subject><subject>Design engineering</subject><subject>Fourier transforms</subject><subject>Microprocessors</subject><subject>Package design</subject><subject>Packaging</subject><subject>Semiconductors</subject><subject>Servers</subject><subject>Systems design</subject><subject>Technology</subject><issn>0018-8646</issn><issn>0018-8646</issn><issn>2151-8556</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2002</creationdate><recordtype>article</recordtype><sourceid>M0C</sourceid><recordid>eNpdkD1PwzAURS0EEqUw8QcsFgaU8vwRO2GDikKlIgZgthz7paSkSbGTSvDrSVUGxFvuG46urg4h5wwmjEl9HfxEKjkBkesDMgJgWZIpqQ7__MfkJMYVAKRS5iNyM6tC7BJqG08jurbxSY1brOnGug-7rJolLdtAu3ek87snii8Ythjodw5wSo5KW0c8-80xeZvdv04fk8Xzw3x6u0gcz6FLNIrSOaVUoVTOGKDLuHaKCUyLPLWOp5B7rnjJQGlWcFc6P5zzjjEsMinG5HLfuwntZ4-xM-sqOqxr22DbR6Ol4KBZJgby4h-5avvQDOMM56BSmQk1QFd7yIU2xoCl2YRqbcOXYWB2Fk3wZrBodhbFDyiBYmw</recordid><startdate>20020701</startdate><enddate>20020701</enddate><creator>Harrer, H.</creator><creator>Pross, H.</creator><creator>Winkel, T.-M.</creator><creator>Becker, W. D.</creator><creator>Stoller, H. I.</creator><creator>Yamamoto, M.</creator><creator>Abe, S.</creator><creator>Chamberlin, B. J.</creator><creator>Katopis, G. A.</creator><general>International Business Machines Corporation</general><scope>AAYXX</scope><scope>CITATION</scope><scope>0U~</scope><scope>1-H</scope><scope>3V.</scope><scope>7WY</scope><scope>7WZ</scope><scope>7XB</scope><scope>87Z</scope><scope>88I</scope><scope>8AL</scope><scope>8AO</scope><scope>8FE</scope><scope>8FG</scope><scope>8FK</scope><scope>8FL</scope><scope>8G5</scope><scope>ABUWG</scope><scope>AFKRA</scope><scope>ARAPS</scope><scope>AZQEC</scope><scope>BEC</scope><scope>BENPR</scope><scope>BEZIV</scope><scope>BGLVJ</scope><scope>CCPQU</scope><scope>DWQXO</scope><scope>FRNLG</scope><scope>F~G</scope><scope>GNUQQ</scope><scope>GUQSH</scope><scope>HCIFZ</scope><scope>JQ2</scope><scope>K60</scope><scope>K6~</scope><scope>K7-</scope><scope>L.-</scope><scope>L.0</scope><scope>M0C</scope><scope>M0N</scope><scope>M2O</scope><scope>M2P</scope><scope>MBDVC</scope><scope>P5Z</scope><scope>P62</scope><scope>PQBIZ</scope><scope>PQBZA</scope><scope>PQEST</scope><scope>PQQKQ</scope><scope>PQUKI</scope><scope>PRINS</scope><scope>Q9U</scope><scope>7SC</scope><scope>8FD</scope><scope>L7M</scope><scope>L~C</scope><scope>L~D</scope></search><sort><creationdate>20020701</creationdate><title>First- and second-level packaging for the IBM eServer z900</title><author>Harrer, H. ; Pross, H. ; Winkel, T.-M. ; Becker, W. D. ; Stoller, H. I. ; Yamamoto, M. ; Abe, S. ; Chamberlin, B. J. ; Katopis, G. A.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c290t-7e3fcc666b669110ec827c613e5b95ac2509d262f10671b2cfcddddcdc11eb843</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2002</creationdate><topic>CMOS</topic><topic>Computer architecture</topic><topic>Computer science</topic><topic>Design</topic><topic>Design engineering</topic><topic>Fourier transforms</topic><topic>Microprocessors</topic><topic>Package design</topic><topic>Packaging</topic><topic>Semiconductors</topic><topic>Servers</topic><topic>Systems design</topic><topic>Technology</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Harrer, H.</creatorcontrib><creatorcontrib>Pross, H.</creatorcontrib><creatorcontrib>Winkel, T.-M.</creatorcontrib><creatorcontrib>Becker, W. D.</creatorcontrib><creatorcontrib>Stoller, H. I.</creatorcontrib><creatorcontrib>Yamamoto, M.</creatorcontrib><creatorcontrib>Abe, S.</creatorcontrib><creatorcontrib>Chamberlin, B. J.</creatorcontrib><creatorcontrib>Katopis, G. A.</creatorcontrib><collection>CrossRef</collection><collection>Global News & ABI/Inform Professional</collection><collection>Trade PRO</collection><collection>ProQuest Central (Corporate)</collection><collection>ABI/INFORM Collection</collection><collection>ABI/INFORM Global (PDF only)</collection><collection>ProQuest Central (purchase pre-March 2016)</collection><collection>ABI/INFORM Global (Alumni Edition)</collection><collection>Science Database (Alumni Edition)</collection><collection>Computing Database (Alumni Edition)</collection><collection>ProQuest Pharma Collection</collection><collection>ProQuest SciTech Collection</collection><collection>ProQuest Technology Collection</collection><collection>ProQuest Central (Alumni) (purchase pre-March 2016)</collection><collection>ABI/INFORM Collection (Alumni Edition)</collection><collection>Research Library (Alumni Edition)</collection><collection>ProQuest Central (Alumni)</collection><collection>ProQuest Central</collection><collection>Advanced Technologies & Aerospace Collection</collection><collection>ProQuest Central Essentials</collection><collection>eLibrary</collection><collection>AUTh Library subscriptions: ProQuest Central</collection><collection>Business Premium Collection</collection><collection>Technology Collection</collection><collection>ProQuest One Community College</collection><collection>ProQuest Central</collection><collection>Business Premium Collection (Alumni)</collection><collection>ABI/INFORM Global (Corporate)</collection><collection>ProQuest Central Student</collection><collection>Research Library Prep</collection><collection>SciTech Premium Collection</collection><collection>ProQuest Computer Science Collection</collection><collection>ProQuest Business Collection (Alumni Edition)</collection><collection>ProQuest Business Collection</collection><collection>Computer Science Database</collection><collection>ABI/INFORM Professional Advanced</collection><collection>ABI/INFORM Professional Standard</collection><collection>ABI/INFORM Global</collection><collection>Computing Database</collection><collection>Research Library</collection><collection>ProQuest Science Journals</collection><collection>Research Library (Corporate)</collection><collection>Advanced Technologies & Aerospace Database</collection><collection>ProQuest Advanced Technologies & Aerospace Collection</collection><collection>One Business (ProQuest)</collection><collection>ProQuest One Business (Alumni)</collection><collection>ProQuest One Academic Eastern Edition (DO NOT USE)</collection><collection>ProQuest One Academic</collection><collection>ProQuest One Academic UKI Edition</collection><collection>ProQuest Central China</collection><collection>ProQuest Central Basic</collection><collection>Computer and Information Systems Abstracts</collection><collection>Technology Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><collection>Computer and Information Systems Abstracts – Academic</collection><collection>Computer and Information Systems Abstracts Professional</collection><jtitle>IBM journal of research and development</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Harrer, H.</au><au>Pross, H.</au><au>Winkel, T.-M.</au><au>Becker, W. D.</au><au>Stoller, H. I.</au><au>Yamamoto, M.</au><au>Abe, S.</au><au>Chamberlin, B. J.</au><au>Katopis, G. A.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>First- and second-level packaging for the IBM eServer z900</atitle><jtitle>IBM journal of research and development</jtitle><date>2002-07-01</date><risdate>2002</risdate><volume>46</volume><issue>4.5</issue><spage>397</spage><epage>420</epage><pages>397-420</pages><issn>0018-8646</issn><eissn>0018-8646</eissn><eissn>2151-8556</eissn><coden>IBMJAE</coden><abstract>The system packaging of the processor cage for the IBM eServer z900 is described. This server contains the world's most complex multichip module, with a wiring length of one kilometer and a maximum power of 1300 W on a glass-ceramic substrate.</abstract><cop>Armonk</cop><pub>International Business Machines Corporation</pub><doi>10.1147/rd.464.0397</doi><tpages>24</tpages></addata></record> |
| fulltext | fulltext |
| identifier | ISSN: 0018-8646 |
| ispartof | IBM journal of research and development, 2002-07, Vol.46 (4.5), p.397-420 |
| issn | 0018-8646 0018-8646 2151-8556 |
| language | eng |
| recordid | cdi_proquest_miscellaneous_743207183 |
| source | IEEE Xplore All Journals; ABI/INFORM Global |
| subjects | CMOS Computer architecture Computer science Design Design engineering Fourier transforms Microprocessors Package design Packaging Semiconductors Servers Systems design Technology |
| title | First- and second-level packaging for the IBM eServer z900 |
| url | http://sfxeu10.hosted.exlibrisgroup.com/loughborough?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-25T17%3A20%3A25IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_cross&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=First-%20and%20second-level%20packaging%20for%20the%20IBM%20eServer%20z900&rft.jtitle=IBM%20journal%20of%20research%20and%20development&rft.au=Harrer,%20H.&rft.date=2002-07-01&rft.volume=46&rft.issue=4.5&rft.spage=397&rft.epage=420&rft.pages=397-420&rft.issn=0018-8646&rft.eissn=0018-8646&rft.coden=IBMJAE&rft_id=info:doi/10.1147/rd.464.0397&rft_dat=%3Cproquest_cross%3E159248811%3C/proquest_cross%3E%3Cgrp_id%3Ecdi_FETCH-LOGICAL-c290t-7e3fcc666b669110ec827c613e5b95ac2509d262f10671b2cfcddddcdc11eb843%3C/grp_id%3E%3Coa%3E%3C/oa%3E%3Curl%3E%3C/url%3E&rft_id=info:oai/&rft_pqid=220654836&rft_id=info:pmid/&rfr_iscdi=true |