Microstructural Evolution of Alloy Powder for Electronic Materials with Liquid Miscibility Gap

The microstructure of powders that are applicable for electronic materials were studied for some systems in which there is a liquid miscibility gap. The characteristic morphologies of an egg-like core type and a uniform second-phase dispersion are shown in relation to the phase diagram, where thermo...

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Bibliographic Details
Published in:Journal of electronic materials 2009, Vol.38 (1), p.2-9
Main Authors: Ohnuma, I., Saegusa, T., Takaku, Y., Wang, C.P., Liu, X.J., Kainuma, R., Ishida, K.
Format: Article
Language:English
Subjects:
Alloys
Characterization and Evaluation of Materials
Chemistry and Materials Science
Cross-disciplinary physics: materials science
rheology
Electronics and Microelectronics
Exact sciences and technology
Instrumentation
Lead free solders
Materials Science
Microstructure
Optical and Electronic Materials
Phase diagrams and microstructures developed by solidification and solid-solid phase transformations
Phase diagrams of metals and alloys
Physics
Powder metallurgy
Silver
Solid State Physics
Thermodynamics
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Summary:The microstructure of powders that are applicable for electronic materials were studied for some systems in which there is a liquid miscibility gap. The characteristic morphologies of an egg-like core type and a uniform second-phase dispersion are shown in relation to the phase diagram, where thermodynamic calculations are a powerful tool for alloy design and the prediction of microstructure. Typical examples of microstructural evolution and properties of Pb-free solders and Ag-based micropowders with high electrical conductivity produced by a gas-atomizing method are presented.
ISSN:0361-5235
1543-186X
DOI:10.1007/s11664-008-0537-x