Improving the reliability of a plastic IC package in the reflow soldering process by DOE

Purpose - Optimisation of the package design in order to reduce stresses in a plastic small outline J-lead (SOJ) package and to thereby prevent fractures during the infrared soldering process.Design methodology approach - Finite element (FE) modelling was used, both with and without crack tip-modell...

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Bibliographic Details
Published in:Soldering & surface mount technology 2005-01, Vol.17 (1), p.40-48
Main Authors: Woo Kim, Geun, Yong Lee, Kang
Format: Article
Language:English
Subjects:
Applied sciences
Design of experiments
Design. Technologies. Operation analysis. Testing
Electronics
Exact sciences and technology
Experiments
Integrated circuits
Materials
Package design
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Soldering
Stress
Stress analysis
Stress materials
Thermal energy
Thermal stability
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Summary:Purpose - Optimisation of the package design in order to reduce stresses in a plastic small outline J-lead (SOJ) package and to thereby prevent fractures during the infrared soldering process.Design methodology approach - Finite element (FE) modelling was used, both with and without crack tip-modelling. A design of experiment (DOE) approach was used to reduce the number of FE models required.Findings - The optimum design values for minimization of thermal stress and the prevention of fracture were found to be different. The results allow the values of design variables such as the dimensions and material properties of the IC package.Practical implications - To reduce the stresses and thereby prevent fracture, the values of the Young's modulus and coefficient of thermal expansion of the epoxy moulding compound should be reduced.Originality value - The work has used both stress analysis and fracture mechanics analysis along with DOE to identify the design values which simultaneously reduce the thermal stresses and prevent the fracture of the IC package.
ISSN:0954-0911
1758-6836
DOI:10.1108/09540910510581147