The influence of multiple reflow cycles on solder joint voids for lead-free PBGAs

Lead-free soldering is becoming a common practice in the electronics industry because of the growing general opposition to lead-containing solders. The reliability of lead-free solders has been studied a lot recently, but knowledge of it is still incomplete and many issues related to them are under...

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Bibliographic Details
Published in:Soldering & surface mount technology 2003-01, Vol.15 (1), p.31-38
Main Authors: Nurmi, S.T, Sundelin, J.J, Ristolainen, E.O, Lepistö, T
Format: Article
Language:English
Subjects:
Applied sciences
Arrays
Design. Technologies. Operation analysis. Testing
Electronic equipment and fabrication. Passive components, printed wiring boards, connectics
Electronics
Electronics industry
Exact sciences and technology
Experiments
Heating
Integrated circuits
Lead free solders
Microelectronic fabrication (materials and surfaces technology)
Plastics
Printed circuit boards
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Temperature
Testing, measurement, noise and reliability
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Summary:Lead-free soldering is becoming a common practice in the electronics industry because of the growing general opposition to lead-containing solders. The reliability of lead-free solders has been studied a lot recently, but knowledge of it is still incomplete and many issues related to them are under heavy debate. This paper presents results from a study of the formation of voids with regard to the number of reflow cycles in three different kinds of solder joints: first the ones prepared with lead-free solder paste and lead-free plastic ball grid array (PBGA) components, next the ones prepared with lead-free solder paste and tin-lead-silver PBGA components, and last the ones prepared with tin-lead solder paste and tin-lead-silver PBGA components.
ISSN:0954-0911
1758-6836
DOI:10.1108/09540910310455707