The effect of PCB surface finish on lead-free solder joints

Purpose - To study the behaviour of voids in PBGA solder joints and their influence on the lifetime of lead-free solder joints.Design methodology approach - The behaviour of voids was studied using micro via and land pad PWBs, PBGA components, and by measuring voids in the solder joints. The lifetim...

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Bibliographic Details
Published in:Soldering & surface mount technology 2005-01, Vol.17 (1), p.13-23
Main Authors: Nurmi, Sami T, Sundelin, Janne J, Ristolainen, Eero O, Lepistö, Toivo K
Format: Article
Language:English
Subjects:
Alloys
Applied sciences
Copper
Design. Technologies. Operation analysis. Testing
Electronic equipment and fabrication. Passive components, printed wiring boards, connectics
Electronics
Electronics industry
Exact sciences and technology
Integrated circuits
Lead free solders
Manufacturing
Printed circuit boards
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Studies
Surface mount technology
Thermal cycling
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Summary:Purpose - To study the behaviour of voids in PBGA solder joints and their influence on the lifetime of lead-free solder joints.Design methodology approach - The behaviour of voids was studied using micro via and land pad PWBs, PBGA components, and by measuring voids in the solder joints. The lifetimes of solder joints were tested using accelerated temperature tests.Findings - Number of factors affecting the solder joint lifetimes were found. The voids were discovered to have a significantly large influence on the solder joints.Practical implications - The findings can be used to achieve better soldering results, methods, and designs.Originality value - In this paper, the effect and the behaviour of voids were studied profoundly. The findings can be valuable to researchers and process personnel.
ISSN:0954-0911
1758-6836
DOI:10.1108/09540910510579203