Fabrication of polymer microstructures for MEMS: sacrificial layer micromolding and patterned substrate micromolding

Two soft lithography based fabrication techniques are employed for fabricating mechanically independent, freely suspended polymer microstructure from poly(n-propyl methacrylate) (PPMA), poly(methyl methacrylate) (PMMA), and polystyrene. Both methods involve a micromolding process followed by thermal...

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Bibliographic Details
Published in:Biomedical microdevices 2007-12, Vol.9 (6), p.815-821
Main Authors: Ferrell, Nicholas, Woodard, James, Hansford, Derek
Format: Article
Language:English
Subjects:
Biocompatible Materials - chemistry
Biotechnology
Equipment Design
Equipment Failure Analysis
Materials Testing
Medical technology
Microfluidics - instrumentation
Microfluidics - methods
Miniaturization
Polymers
Polymers - chemistry
Process engineering
Substrates
Surface Properties
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Summary:Two soft lithography based fabrication techniques are employed for fabricating mechanically independent, freely suspended polymer microstructure from poly(n-propyl methacrylate) (PPMA), poly(methyl methacrylate) (PMMA), and polystyrene. Both methods involve a micromolding process followed by thermal bonding to the substrate. The first method, sacrificial layer micromolding, uses a water soluble sacrificial layer, allowing functional structures to be released by immersion in water. The second method, patterned substrate micromolding, uses a permanent substrate patterned via photolithography. Functional regions of the polymer MEMS are suspended over the voids in the photoresist pattern. The processes have been applied to the fabrication of polymer microstructures with a variety of geometries for specific applications. Devices have included microcantilevers, beams, and other more complicated microstructures. The thermal molding process is conceivably applicable to the fabrication of microstructures from a wide variety of thermoplastic polymers, allowing material selection to be tailored based on application.
ISSN:1387-2176
1572-8781
DOI:10.1007/s10544-007-9094-y