Engineering solder paste performance through controlled stress rheology analysis

The rheology of solder paste significantly affects the qualities of stencil printing, tack and slump performance. This paper describes a series of tests performed on solder paste to investigate and determine the rheological properties of a group of solder pastes and fluxes, and the correlation of th...

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Published in:Soldering & surface mount technology 1998-08, Vol.10 (2), p.26-35
Main Authors: Bao, Xiaohua, Lee, Ning-Cheng, Raj, Rajkumar B, Rangan, K.P, Maria, Anu
Format: Article
Language:English
Subjects:
Creep tests
Deformation
Experiments
Indium
Particle size
Rheology
Solder paste
Soldering
Stress
Viscoelasticity
Viscosity
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cited_by cdi_FETCH-LOGICAL-c480t-33b5ccc43cb96157969bf4bc5869a9ec03cc2859a08059b97c835c12efc260b93
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container_end_page 35
container_issue 2
container_start_page 26
container_title Soldering & surface mount technology
container_volume 10
creator Bao, Xiaohua
Lee, Ning-Cheng
Raj, Rajkumar B
Rangan, K.P
Maria, Anu
description The rheology of solder paste significantly affects the qualities of stencil printing, tack and slump performance. This paper describes a series of tests performed on solder paste to investigate and determine the rheological properties of a group of solder pastes and fluxes, and the correlation of those properties with paste performance prior to reflow. Data indicate that: the incidence of print defects are proportional to the material's compliant qualities (J1 and J2) and are inversely proportional to the elastic properties (G¢ G¢¢ and recovery) and meta-rigidity (yield stress); slump resistance is proportional to elastic properties (recovery), solid characteristics (stress [G¢ = G¢¢]), and rigidity (|G*|); and that high elastic properties (recovery), low compliance (J1 and J2), and low solid characteristics (stress [G¢ = G¢¢]) are required in order to achieve high tack value. Good correlation between fluxes and solder pastes were observed for yield stress and recovery only, suggesting that those two properties are primarily dictated by fluxes.
doi_str_mv 10.1108/09540919810219949
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fullrecord <record><control><sourceid>proquest_istex</sourceid><recordid>TN_cdi_proquest_miscellaneous_743706840</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>86923764</sourcerecordid><originalsourceid>FETCH-LOGICAL-c480t-33b5ccc43cb96157969bf4bc5869a9ec03cc2859a08059b97c835c12efc260b93</originalsourceid><addsrcrecordid>eNqN0U1v1DAQBmALUYml5QdwizjAhdBx_DlHVLWFVaX2UOBoOd7Jbko2DnZW6v57XC3i0CJUX-bg57WleRl7y-ET52BPAZUE5Gg5NBxR4gu24EbZWluhX7LFw31dAH_FXud8BwBSo1iwm_Nx3Y9EqR_XVY7DilI1-TxTNVHqYtr6MVA1b1LcrTdViOOc4jDQqspzopyrtKE4xPW-8qMf9rnPJ-yo80OmN3_mMft2cX579qW-ur78evb5qg7SwlwL0aoQghShRc2VQY1tJ9ugrEaPFECE0FiFHiwobNEEK1TgDXWh0dCiOGYfDu9OKf7aUZ7dts-BhsGPFHfZGSkMaCuhyPf_lU1BKOEZUJfTCFPgu0fwLu5SWUAxXDdlzUYUxA8opJhzos5Nqd_6tHcc3ENn7klnJVMfMn1p4P5vwKefThthlJM_Gne7RHO5vFm678XDwdOWkh9Wz_ri478jT6ibVp34DbBVs9Y</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>216209173</pqid></control><display><type>article</type><title>Engineering solder paste performance through controlled stress rheology analysis</title><source>Emerald:Jisc Collections:Emerald Subject Collections HE and FE 2024-2026:Emerald Premier (reading list)</source><creator>Bao, Xiaohua ; Lee, Ning-Cheng ; Raj, Rajkumar B ; Rangan, K.P ; Maria, Anu</creator><creatorcontrib>Bao, Xiaohua ; Lee, Ning-Cheng ; Raj, Rajkumar B ; Rangan, K.P ; Maria, Anu</creatorcontrib><description>The rheology of solder paste significantly affects the qualities of stencil printing, tack and slump performance. This paper describes a series of tests performed on solder paste to investigate and determine the rheological properties of a group of solder pastes and fluxes, and the correlation of those properties with paste performance prior to reflow. Data indicate that: the incidence of print defects are proportional to the material's compliant qualities (J1 and J2) and are inversely proportional to the elastic properties (G¢ G¢¢ and recovery) and meta-rigidity (yield stress); slump resistance is proportional to elastic properties (recovery), solid characteristics (stress [G¢ = G¢¢]), and rigidity (|G*|); and that high elastic properties (recovery), low compliance (J1 and J2), and low solid characteristics (stress [G¢ = G¢¢]) are required in order to achieve high tack value. Good correlation between fluxes and solder pastes were observed for yield stress and recovery only, suggesting that those two properties are primarily dictated by fluxes.</description><identifier>ISSN: 0954-0911</identifier><identifier>EISSN: 1758-6836</identifier><identifier>DOI: 10.1108/09540919810219949</identifier><identifier>CODEN: SSMOEO</identifier><language>eng</language><publisher>Bradford: MCB UP Ltd</publisher><subject>Creep tests ; Deformation ; Experiments ; Indium ; Particle size ; Rheology ; Solder paste ; Soldering ; Stress ; Viscoelasticity ; Viscosity</subject><ispartof>Soldering &amp; surface mount technology, 1998-08, Vol.10 (2), p.26-35</ispartof><rights>MCB UP Limited</rights><rights>Copyright MCB UP Limited (MCB) 1998</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c480t-33b5ccc43cb96157969bf4bc5869a9ec03cc2859a08059b97c835c12efc260b93</citedby></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>314,780,784,27924,27925</link.rule.ids></links><search><creatorcontrib>Bao, Xiaohua</creatorcontrib><creatorcontrib>Lee, Ning-Cheng</creatorcontrib><creatorcontrib>Raj, Rajkumar B</creatorcontrib><creatorcontrib>Rangan, K.P</creatorcontrib><creatorcontrib>Maria, Anu</creatorcontrib><title>Engineering solder paste performance through controlled stress rheology analysis</title><title>Soldering &amp; surface mount technology</title><description>The rheology of solder paste significantly affects the qualities of stencil printing, tack and slump performance. This paper describes a series of tests performed on solder paste to investigate and determine the rheological properties of a group of solder pastes and fluxes, and the correlation of those properties with paste performance prior to reflow. Data indicate that: the incidence of print defects are proportional to the material's compliant qualities (J1 and J2) and are inversely proportional to the elastic properties (G¢ G¢¢ and recovery) and meta-rigidity (yield stress); slump resistance is proportional to elastic properties (recovery), solid characteristics (stress [G¢ = G¢¢]), and rigidity (|G*|); and that high elastic properties (recovery), low compliance (J1 and J2), and low solid characteristics (stress [G¢ = G¢¢]) are required in order to achieve high tack value. Good correlation between fluxes and solder pastes were observed for yield stress and recovery only, suggesting that those two properties are primarily dictated by fluxes.</description><subject>Creep tests</subject><subject>Deformation</subject><subject>Experiments</subject><subject>Indium</subject><subject>Particle size</subject><subject>Rheology</subject><subject>Solder paste</subject><subject>Soldering</subject><subject>Stress</subject><subject>Viscoelasticity</subject><subject>Viscosity</subject><issn>0954-0911</issn><issn>1758-6836</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>1998</creationdate><recordtype>article</recordtype><recordid>eNqN0U1v1DAQBmALUYml5QdwizjAhdBx_DlHVLWFVaX2UOBoOd7Jbko2DnZW6v57XC3i0CJUX-bg57WleRl7y-ET52BPAZUE5Gg5NBxR4gu24EbZWluhX7LFw31dAH_FXud8BwBSo1iwm_Nx3Y9EqR_XVY7DilI1-TxTNVHqYtr6MVA1b1LcrTdViOOc4jDQqspzopyrtKE4xPW-8qMf9rnPJ-yo80OmN3_mMft2cX579qW-ur78evb5qg7SwlwL0aoQghShRc2VQY1tJ9ugrEaPFECE0FiFHiwobNEEK1TgDXWh0dCiOGYfDu9OKf7aUZ7dts-BhsGPFHfZGSkMaCuhyPf_lU1BKOEZUJfTCFPgu0fwLu5SWUAxXDdlzUYUxA8opJhzos5Nqd_6tHcc3ENn7klnJVMfMn1p4P5vwKefThthlJM_Gne7RHO5vFm678XDwdOWkh9Wz_ri478jT6ibVp34DbBVs9Y</recordid><startdate>19980801</startdate><enddate>19980801</enddate><creator>Bao, Xiaohua</creator><creator>Lee, Ning-Cheng</creator><creator>Raj, Rajkumar B</creator><creator>Rangan, K.P</creator><creator>Maria, Anu</creator><general>MCB UP Ltd</general><general>Emerald Group Publishing Limited</general><scope>BSCLL</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7RQ</scope><scope>7SP</scope><scope>7TB</scope><scope>7WY</scope><scope>7XB</scope><scope>8BQ</scope><scope>8FD</scope><scope>8FE</scope><scope>8FG</scope><scope>ABJCF</scope><scope>AFKRA</scope><scope>AZQEC</scope><scope>BENPR</scope><scope>BEZIV</scope><scope>BGLVJ</scope><scope>CCPQU</scope><scope>D1I</scope><scope>DWQXO</scope><scope>FR3</scope><scope>GNUQQ</scope><scope>HCIFZ</scope><scope>JG9</scope><scope>K6~</scope><scope>KB.</scope><scope>KR7</scope><scope>L.-</scope><scope>L7M</scope><scope>M0F</scope><scope>M2P</scope><scope>PDBOC</scope><scope>PQBIZ</scope><scope>PQEST</scope><scope>PQQKQ</scope><scope>PQUKI</scope><scope>Q9U</scope></search><sort><creationdate>19980801</creationdate><title>Engineering solder paste performance through controlled stress rheology analysis</title><author>Bao, Xiaohua ; Lee, Ning-Cheng ; Raj, Rajkumar B ; Rangan, K.P ; Maria, Anu</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c480t-33b5ccc43cb96157969bf4bc5869a9ec03cc2859a08059b97c835c12efc260b93</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>1998</creationdate><topic>Creep tests</topic><topic>Deformation</topic><topic>Experiments</topic><topic>Indium</topic><topic>Particle size</topic><topic>Rheology</topic><topic>Solder paste</topic><topic>Soldering</topic><topic>Stress</topic><topic>Viscoelasticity</topic><topic>Viscosity</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Bao, Xiaohua</creatorcontrib><creatorcontrib>Lee, Ning-Cheng</creatorcontrib><creatorcontrib>Raj, Rajkumar B</creatorcontrib><creatorcontrib>Rangan, K.P</creatorcontrib><creatorcontrib>Maria, Anu</creatorcontrib><collection>Istex</collection><collection>CrossRef</collection><collection>Career &amp; Technical Education Database</collection><collection>Electronics &amp; Communications Abstracts</collection><collection>Mechanical &amp; Transportation Engineering Abstracts</collection><collection>ABI/INFORM Complete</collection><collection>ProQuest Central (purchase pre-March 2016)</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>ProQuest SciTech Collection</collection><collection>ProQuest Technology Collection</collection><collection>Materials Science &amp; Engineering Collection</collection><collection>ProQuest Central</collection><collection>ProQuest Central Essentials</collection><collection>AUTh Library subscriptions: ProQuest Central</collection><collection>Business Premium Collection</collection><collection>Technology Collection</collection><collection>ProQuest One Community College</collection><collection>ProQuest Materials Science Collection</collection><collection>ProQuest Central Korea</collection><collection>Engineering Research Database</collection><collection>ProQuest Central Student</collection><collection>SciTech Premium Collection</collection><collection>Materials Research Database</collection><collection>ProQuest Business Collection</collection><collection>https://resources.nclive.org/materials</collection><collection>Civil Engineering Abstracts</collection><collection>ABI/INFORM Professional Advanced</collection><collection>Advanced Technologies Database with Aerospace</collection><collection>ABI/INFORM Trade &amp; Industry</collection><collection>ProQuest Science Journals</collection><collection>Materials science collection</collection><collection>One Business (ProQuest)</collection><collection>ProQuest One Academic Eastern Edition (DO NOT USE)</collection><collection>ProQuest One Academic</collection><collection>ProQuest One Academic UKI Edition</collection><collection>ProQuest Central Basic</collection><jtitle>Soldering &amp; surface mount technology</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Bao, Xiaohua</au><au>Lee, Ning-Cheng</au><au>Raj, Rajkumar B</au><au>Rangan, K.P</au><au>Maria, Anu</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Engineering solder paste performance through controlled stress rheology analysis</atitle><jtitle>Soldering &amp; surface mount technology</jtitle><date>1998-08-01</date><risdate>1998</risdate><volume>10</volume><issue>2</issue><spage>26</spage><epage>35</epage><pages>26-35</pages><issn>0954-0911</issn><eissn>1758-6836</eissn><coden>SSMOEO</coden><abstract>The rheology of solder paste significantly affects the qualities of stencil printing, tack and slump performance. This paper describes a series of tests performed on solder paste to investigate and determine the rheological properties of a group of solder pastes and fluxes, and the correlation of those properties with paste performance prior to reflow. Data indicate that: the incidence of print defects are proportional to the material's compliant qualities (J1 and J2) and are inversely proportional to the elastic properties (G¢ G¢¢ and recovery) and meta-rigidity (yield stress); slump resistance is proportional to elastic properties (recovery), solid characteristics (stress [G¢ = G¢¢]), and rigidity (|G*|); and that high elastic properties (recovery), low compliance (J1 and J2), and low solid characteristics (stress [G¢ = G¢¢]) are required in order to achieve high tack value. Good correlation between fluxes and solder pastes were observed for yield stress and recovery only, suggesting that those two properties are primarily dictated by fluxes.</abstract><cop>Bradford</cop><pub>MCB UP Ltd</pub><doi>10.1108/09540919810219949</doi><tpages>10</tpages></addata></record>
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source Emerald:Jisc Collections:Emerald Subject Collections HE and FE 2024-2026:Emerald Premier (reading list)
subjects Creep tests
Deformation
Experiments
Indium
Particle size
Rheology
Solder paste
Soldering
Stress
Viscoelasticity
Viscosity
title Engineering solder paste performance through controlled stress rheology analysis
url http://sfxeu10.hosted.exlibrisgroup.com/loughborough?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-29T19%3A52%3A42IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_istex&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Engineering%20solder%20paste%20performance%20through%20controlled%20stress%20rheology%20analysis&rft.jtitle=Soldering%20&%20surface%20mount%20technology&rft.au=Bao,%20Xiaohua&rft.date=1998-08-01&rft.volume=10&rft.issue=2&rft.spage=26&rft.epage=35&rft.pages=26-35&rft.issn=0954-0911&rft.eissn=1758-6836&rft.coden=SSMOEO&rft_id=info:doi/10.1108/09540919810219949&rft_dat=%3Cproquest_istex%3E86923764%3C/proquest_istex%3E%3Cgrp_id%3Ecdi_FETCH-LOGICAL-c480t-33b5ccc43cb96157969bf4bc5869a9ec03cc2859a08059b97c835c12efc260b93%3C/grp_id%3E%3Coa%3E%3C/oa%3E%3Curl%3E%3C/url%3E&rft_id=info:oai/&rft_pqid=216209173&rft_id=info:pmid/&rfr_iscdi=true