Surface science issues in plasma etching

Pattern transfer by plasma-based etching is one of several key processes required for fabricating silicon-based integrated circuits. We present a brief review of elementary plasma-etching processes on surfaces and within integrated-circuit microstructures -- and an overview of recent work in our lab...

Full description

Saved in:
Bibliographic Details
Published in:IBM journal of research and development 1999-01, Vol.43 (1-2), p.181-197
Main Authors: Oehrlein, G S, Doemling, M F, Kastenmeier, B E E, Matsuo, P J
Format: Article
Language:English
Subjects:
Integrated circuits
Plasma
Plasma etching
R&D
Research & development
Silicon
Citations: Items that cite this one
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:Pattern transfer by plasma-based etching is one of several key processes required for fabricating silicon-based integrated circuits. We present a brief review of elementary plasma-etching processes on surfaces and within integrated-circuit microstructures -- and an overview of recent work in our laboratory on plasma-etching aspects of the formation of self-aligned contacts to a polysilicon layer through a SiO2 layer and a Si3N4 etch-stop layer.
ISSN:0018-8646
0018-8646
2151-8556
DOI:10.1147/rd.431.0181