Creep and Stress Rupture Behavior of an Advanced Silicon Nitride: Part III, Stress Rupture and the Monkman-Grant Relationship

The applicability of the Monkman–Grant relationship to predict the stress rupture life of NT154 silicon nitride is examined. The data show that the Monkman–Grant lines relating rupture life to minimum creep rate are stratified with respect to temperature. A modification to the current expression for...

Full description

Saved in:
Bibliographic Details
Published in:Journal of the American Ceramic Society 1994-05, Vol.77 (5), p.1235-1241
Main Authors: Menon, Mamballykalathil N., Fang, Ho T., Wu, David C., Jenkins, Michael G., Ferber, Mattison K.
Format: Article
Language:English
Subjects:
Ceramic materials
Crack propagation
Creep
Failure (mechanical)
Mathematical models
Stresses
Thermal effects
Citations: Items that this one cites
Items that cite this one
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
cited_by cdi_FETCH-LOGICAL-c3035-2b59d5c881c96c933ebb1de4eb41c0985ec89495c406bdbee6279d99b7c81ae43
cites cdi_FETCH-LOGICAL-c3035-2b59d5c881c96c933ebb1de4eb41c0985ec89495c406bdbee6279d99b7c81ae43
container_end_page 1241
container_issue 5
container_start_page 1235
container_title Journal of the American Ceramic Society
container_volume 77
creator Menon, Mamballykalathil N.
Fang, Ho T.
Wu, David C.
Jenkins, Michael G.
Ferber, Mattison K.
description The applicability of the Monkman–Grant relationship to predict the stress rupture life of NT154 silicon nitride is examined. The data show that the Monkman–Grant lines relating rupture life to minimum creep rate are stratified with respect to temperature. A modification to the current expression for the Monkman–Grant relation is proposed to accommodate this temperature dependence. A phenomenological approach based on crack growth as the failure mechanism is presented to explain this temperature dependence. The results can be interpreted as suggesting that the stress dependence of the failure process is greater than that for creep.
doi_str_mv 10.1111/j.1151-2916.1994.tb05397.x
format article
fullrecord <record><control><sourceid>proquest_cross</sourceid><recordid>TN_cdi_proquest_miscellaneous_744570073</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>744570073</sourcerecordid><originalsourceid>FETCH-LOGICAL-c3035-2b59d5c881c96c933ebb1de4eb41c0985ec89495c406bdbee6279d99b7c81ae43</originalsourceid><addsrcrecordid>eNqVkD1v2zAQhomiBeKm-Q9Eli6RS4qkKGaqY7iug3y6aZKNoKgzTEeWFJJOnaH_PRJsZOjWWw6He99neBA6pmRIu_m26pagSapoNqRK8WEsiGBKDrcf0ICK_esjGhBC0kTmKTlAn0NYdSdVOR-gv2MP0GJTl_hX9BACnm_auPGAz2BpXlzjcbPo3nhUvpjaQhdzlbNNja9c9K6EU3xjfMSz2ezkX0IPjUvAl039tDZ1MvWmjngOlYmuqcPStV_Qp4WpAhzt9yH6_WNyN_6ZXFxPZ-PRRWIZYSJJC6FKYfOcWpVZxRgUBS2BQ8GpJSoXYHPFlbCcZEVZAGSpVKVShbQ5NcDZIfq647a-ed5AiHrtgoWqMjU0m6Al50ISIlmXPN0lrW9C8LDQrXdr4181JbpXrle6V657r7pXrvfK9bYrf9-V_7gKXv-jqc9H4wlNmegQyQ7hQoTtO8L4J51JJoV-uJrqWynuH-f5VFP2BkZwmXw</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>744570073</pqid></control><display><type>article</type><title>Creep and Stress Rupture Behavior of an Advanced Silicon Nitride: Part III, Stress Rupture and the Monkman-Grant Relationship</title><source>Wiley-Blackwell Materials Science Backfiles</source><creator>Menon, Mamballykalathil N. ; Fang, Ho T. ; Wu, David C. ; Jenkins, Michael G. ; Ferber, Mattison K.</creator><creatorcontrib>Menon, Mamballykalathil N. ; Fang, Ho T. ; Wu, David C. ; Jenkins, Michael G. ; Ferber, Mattison K.</creatorcontrib><description>The applicability of the Monkman–Grant relationship to predict the stress rupture life of NT154 silicon nitride is examined. The data show that the Monkman–Grant lines relating rupture life to minimum creep rate are stratified with respect to temperature. A modification to the current expression for the Monkman–Grant relation is proposed to accommodate this temperature dependence. A phenomenological approach based on crack growth as the failure mechanism is presented to explain this temperature dependence. The results can be interpreted as suggesting that the stress dependence of the failure process is greater than that for creep.</description><identifier>ISSN: 0002-7820</identifier><identifier>EISSN: 1551-2916</identifier><identifier>DOI: 10.1111/j.1151-2916.1994.tb05397.x</identifier><language>eng</language><publisher>Oxford, UK: Blackwell Publishing Ltd</publisher><subject>Ceramic materials ; Crack propagation ; Creep ; Failure (mechanical) ; Mathematical models ; Stresses ; Thermal effects</subject><ispartof>Journal of the American Ceramic Society, 1994-05, Vol.77 (5), p.1235-1241</ispartof><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c3035-2b59d5c881c96c933ebb1de4eb41c0985ec89495c406bdbee6279d99b7c81ae43</citedby><cites>FETCH-LOGICAL-c3035-2b59d5c881c96c933ebb1de4eb41c0985ec89495c406bdbee6279d99b7c81ae43</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://onlinelibrary.wiley.com/doi/pdf/10.1111%2Fj.1151-2916.1994.tb05397.x$$EPDF$$P50$$Gwiley$$H</linktopdf><linktohtml>$$Uhttps://onlinelibrary.wiley.com/doi/full/10.1111%2Fj.1151-2916.1994.tb05397.x$$EHTML$$P50$$Gwiley$$H</linktohtml><link.rule.ids>314,780,784,1421,27924,27925,46438,46862</link.rule.ids></links><search><creatorcontrib>Menon, Mamballykalathil N.</creatorcontrib><creatorcontrib>Fang, Ho T.</creatorcontrib><creatorcontrib>Wu, David C.</creatorcontrib><creatorcontrib>Jenkins, Michael G.</creatorcontrib><creatorcontrib>Ferber, Mattison K.</creatorcontrib><title>Creep and Stress Rupture Behavior of an Advanced Silicon Nitride: Part III, Stress Rupture and the Monkman-Grant Relationship</title><title>Journal of the American Ceramic Society</title><description>The applicability of the Monkman–Grant relationship to predict the stress rupture life of NT154 silicon nitride is examined. The data show that the Monkman–Grant lines relating rupture life to minimum creep rate are stratified with respect to temperature. A modification to the current expression for the Monkman–Grant relation is proposed to accommodate this temperature dependence. A phenomenological approach based on crack growth as the failure mechanism is presented to explain this temperature dependence. The results can be interpreted as suggesting that the stress dependence of the failure process is greater than that for creep.</description><subject>Ceramic materials</subject><subject>Crack propagation</subject><subject>Creep</subject><subject>Failure (mechanical)</subject><subject>Mathematical models</subject><subject>Stresses</subject><subject>Thermal effects</subject><issn>0002-7820</issn><issn>1551-2916</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>1994</creationdate><recordtype>article</recordtype><recordid>eNqVkD1v2zAQhomiBeKm-Q9Eli6RS4qkKGaqY7iug3y6aZKNoKgzTEeWFJJOnaH_PRJsZOjWWw6He99neBA6pmRIu_m26pagSapoNqRK8WEsiGBKDrcf0ICK_esjGhBC0kTmKTlAn0NYdSdVOR-gv2MP0GJTl_hX9BACnm_auPGAz2BpXlzjcbPo3nhUvpjaQhdzlbNNja9c9K6EU3xjfMSz2ezkX0IPjUvAl039tDZ1MvWmjngOlYmuqcPStV_Qp4WpAhzt9yH6_WNyN_6ZXFxPZ-PRRWIZYSJJC6FKYfOcWpVZxRgUBS2BQ8GpJSoXYHPFlbCcZEVZAGSpVKVShbQ5NcDZIfq647a-ed5AiHrtgoWqMjU0m6Al50ISIlmXPN0lrW9C8LDQrXdr4181JbpXrle6V657r7pXrvfK9bYrf9-V_7gKXv-jqc9H4wlNmegQyQ7hQoTtO8L4J51JJoV-uJrqWynuH-f5VFP2BkZwmXw</recordid><startdate>199405</startdate><enddate>199405</enddate><creator>Menon, Mamballykalathil N.</creator><creator>Fang, Ho T.</creator><creator>Wu, David C.</creator><creator>Jenkins, Michael G.</creator><creator>Ferber, Mattison K.</creator><general>Blackwell Publishing Ltd</general><scope>BSCLL</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7TC</scope></search><sort><creationdate>199405</creationdate><title>Creep and Stress Rupture Behavior of an Advanced Silicon Nitride: Part III, Stress Rupture and the Monkman-Grant Relationship</title><author>Menon, Mamballykalathil N. ; Fang, Ho T. ; Wu, David C. ; Jenkins, Michael G. ; Ferber, Mattison K.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c3035-2b59d5c881c96c933ebb1de4eb41c0985ec89495c406bdbee6279d99b7c81ae43</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>1994</creationdate><topic>Ceramic materials</topic><topic>Crack propagation</topic><topic>Creep</topic><topic>Failure (mechanical)</topic><topic>Mathematical models</topic><topic>Stresses</topic><topic>Thermal effects</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Menon, Mamballykalathil N.</creatorcontrib><creatorcontrib>Fang, Ho T.</creatorcontrib><creatorcontrib>Wu, David C.</creatorcontrib><creatorcontrib>Jenkins, Michael G.</creatorcontrib><creatorcontrib>Ferber, Mattison K.</creatorcontrib><collection>Istex</collection><collection>CrossRef</collection><collection>Mechanical Engineering Abstracts</collection><jtitle>Journal of the American Ceramic Society</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Menon, Mamballykalathil N.</au><au>Fang, Ho T.</au><au>Wu, David C.</au><au>Jenkins, Michael G.</au><au>Ferber, Mattison K.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Creep and Stress Rupture Behavior of an Advanced Silicon Nitride: Part III, Stress Rupture and the Monkman-Grant Relationship</atitle><jtitle>Journal of the American Ceramic Society</jtitle><date>1994-05</date><risdate>1994</risdate><volume>77</volume><issue>5</issue><spage>1235</spage><epage>1241</epage><pages>1235-1241</pages><issn>0002-7820</issn><eissn>1551-2916</eissn><abstract>The applicability of the Monkman–Grant relationship to predict the stress rupture life of NT154 silicon nitride is examined. The data show that the Monkman–Grant lines relating rupture life to minimum creep rate are stratified with respect to temperature. A modification to the current expression for the Monkman–Grant relation is proposed to accommodate this temperature dependence. A phenomenological approach based on crack growth as the failure mechanism is presented to explain this temperature dependence. The results can be interpreted as suggesting that the stress dependence of the failure process is greater than that for creep.</abstract><cop>Oxford, UK</cop><pub>Blackwell Publishing Ltd</pub><doi>10.1111/j.1151-2916.1994.tb05397.x</doi><tpages>7</tpages></addata></record>
fulltext fulltext
identifier ISSN: 0002-7820
ispartof Journal of the American Ceramic Society, 1994-05, Vol.77 (5), p.1235-1241
issn 0002-7820
1551-2916
language eng
recordid cdi_proquest_miscellaneous_744570073
source Wiley-Blackwell Materials Science Backfiles
subjects Ceramic materials
Crack propagation
Creep
Failure (mechanical)
Mathematical models
Stresses
Thermal effects
title Creep and Stress Rupture Behavior of an Advanced Silicon Nitride: Part III, Stress Rupture and the Monkman-Grant Relationship
url http://sfxeu10.hosted.exlibrisgroup.com/loughborough?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-27T06%3A37%3A45IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_cross&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Creep%20and%20Stress%20Rupture%20Behavior%20of%20an%20Advanced%20Silicon%20Nitride:%20Part%20III,%20Stress%20Rupture%20and%20the%20Monkman-Grant%20Relationship&rft.jtitle=Journal%20of%20the%20American%20Ceramic%20Society&rft.au=Menon,%20Mamballykalathil%20N.&rft.date=1994-05&rft.volume=77&rft.issue=5&rft.spage=1235&rft.epage=1241&rft.pages=1235-1241&rft.issn=0002-7820&rft.eissn=1551-2916&rft_id=info:doi/10.1111/j.1151-2916.1994.tb05397.x&rft_dat=%3Cproquest_cross%3E744570073%3C/proquest_cross%3E%3Cgrp_id%3Ecdi_FETCH-LOGICAL-c3035-2b59d5c881c96c933ebb1de4eb41c0985ec89495c406bdbee6279d99b7c81ae43%3C/grp_id%3E%3Coa%3E%3C/oa%3E%3Curl%3E%3C/url%3E&rft_id=info:oai/&rft_pqid=744570073&rft_id=info:pmid/&rfr_iscdi=true