Mechanics of shaft-loaded blister test for thin film suspended on compliant substrate

• Published in: International journal of solids and structures 2010-09, Vol.47 (18), p.2525-2532
• Main Authors: Zhao, MingHao, Zheng, WeiLing, Fan, CuiYing
• Format: Article
• Language: English
• Subjects: Analytical solution; Applied sciences; Blistering; Compliant substrate; Condensed matter: structure, mechanical and thermal properties; Cross sections; Deflection; Deformation effects; Drives; Exact sciences and technology; Fundamental areas of phenomenology (including applications); Mathematical analysis; Mathematical models; Measurement and testing methods; Mechanical and acoustical properties; Mechanical engineering. Machine design; Numerical solution; Physical properties of thin films, nonelectronic; Physics; Residual stress; Shaft-loaded blister test; Shafts, couplings, clutches, brakes; Solid mechanics; Springs; Static elasticity (thermoelasticity...); Structural and continuum mechanics; Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties); Thin film; Thin films
• ISSN: 0020-7683; 1879-2146
• DOI: 10.1016/j.ijsolstr.2010.05.011

Based on the von Kármán plate theory, the mechanics of a shaft-loaded blister test for thin film/substrate systems is studied by considering elastic substrate deformations and residual stresses in these films. In testing, films are attached to a substrate provided with a circular hole, through which loading is applied to the film by a flat-ended shaft of circular cross-section. The effect of substrate deformation on the deflection of the loaded film is taken into account by using a line spring model. For small deflections, an analytical solution is derived, while for large deflections a numerical solution is obtained using the shooting method. The resulting load-shaft displacement relation, which is essential in blister tests, compares favorably with finite element analysis.