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Synthesis of Fe metal precipitated colloidal silica and its application to W chemical mechanical polishing (CMP) slurry
Precipitation of Fe metal ions on colloidal silica particle for the application of W CMP process. The objective of this paper is to develop a new method of Fe (metal) precipitation on colloidal silica to overcome the stability problem, which would be responsible in producing defects, with commercial...
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Published in: | Journal of colloid and interface science 2010-09, Vol.349 (1), p.402-407 |
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Main Authors: | , , , , |
Format: | Article |
Language: | English |
Subjects: | |
Citations: | Items that this one cites Items that cite this one |
Online Access: | Get full text |
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Summary: | Precipitation of Fe metal ions on colloidal silica particle for the application of W CMP process.
The objective of this paper is to develop a new method of Fe (metal) precipitation on colloidal silica to overcome the stability problem, which would be responsible in producing defects, with commercially available fumed silica slurry containing Fe ions. The slurry was developed by using sodium silicate (Na
2SiO
3) as a raw material and the concentration of precipitation of metal was controlled by addition of Fe salt (Fe(NO
3)
3). To compare the concentration of precipitated Fe with directly added Fe ions in slurry solutions, static electrochemical and peroxide decomposition experiments were performed. Although the performance of the Fe precipitation appeared to be lower than Fe ion addition during these experiments, nearly equal removal rate was observed due to the dynamic condition during polishing. The Fe precipitated colloidal silica particles at the concentration of 52
ppm showed the similar W removal rate and selectivity of W to TEOS (tetraethylorthosilicate) to commercially available fumed silica slurry containing externally added Fe ions. The introduction of Fe particle precipitation on colloidal silica particles would result in a longer shelf life time and hence lower defect level in W CMP. |
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ISSN: | 0021-9797 1095-7103 |
DOI: | 10.1016/j.jcis.2010.04.083 |