Surface patterning nanoparticle-based arrays

In this study, focused ion beam lithography is used to pattern different size and shape island arrays on silicon wafers. Cavity arrays of inverse shapes are then made on silicone mold surfaces by polymerization. After that, Al 2 O 3 nanoparticle-based island arrays are created by a surface feature t...

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Bibliographic Details
Published in:Journal of materials science 2010-02, Vol.45 (3), p.582-588
Main Authors: Lu, Kathy, Hammond, Chase, Qian, Junmin
Format: Article
Language:English
Subjects:
Aluminum oxide
Arrays
Characterization and Evaluation of Materials
Classical Mechanics
Coatings
Colloiding
Cracks
Crystallography and Scattering Methods
Founding
Freezing
Gold
Ion beams
Materials Science
Molds
Nanocomposites
Nanomaterials
Nanoparticles
Nanostructure
Patterning
Platinum
Polymer Sciences
Polymerization
Silicon wafers
Silicones
Solid Mechanics
Wettability
Wetting
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Summary:In this study, focused ion beam lithography is used to pattern different size and shape island arrays on silicon wafers. Cavity arrays of inverse shapes are then made on silicone mold surfaces by polymerization. After that, Al 2 O 3 nanoparticle-based island arrays are created by a surface feature transfer and freeze casting process using an Al 2 O 3 colloidal suspension. The effects of silicone mold surface wettability and freezing rate on the Al 2 O 3 nanoparticle pattern quality are investigated. The results show that coating the silicone mold surface with a 10 nm thick Au–Pt layer makes the Al 2 O 3 nanoparticle suspension more wetting on the mold surface and also likely reduces the dry Al 2 O 3 nanoparticle adhesion to the mold surface. Freezing rate should be lower than 1 °C/min to avoid cracks or loose Al 2 O 3 nanoparticle packing in the freeze cast features. When these factors are properly controlled, the reported patterning process allows reproduction of micron-size feature arrays from Al 2 O 3 nanoparticle suspensions. The studied approach should be applicable to most nanoparticle-based materials and open numerous opportunities for direct-device fabrication.
ISSN:0022-2461
1573-4803
DOI:10.1007/s10853-009-3930-9