Experimental study of density, surface tension, and contact angle of Sn–Sb-based alloys for high temperature soldering

The density and the surface tension of binary Sn–Sb and ternary Sn–Sb–Cu liquid alloys have been measured over a wide temperature range by the sessile-drop method. The experimental data for the surface tension were analyzed by the Butler thermodynamic model. Investigations of the wetting behavior of...

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Bibliographic Details
Published in:Journal of materials science 2010-04, Vol.45 (8), p.2051-2056
Main Authors: Plevachuk, Yu, Hoyer, W., Kaban, I., Köhler, M., Novakovic, R.
Format: Article
Language:English
Subjects:
Alloys
Analysis
Antimony
Antimony base alloys
Characterization and Evaluation of Materials
Chemistry and Materials Science
Classical Mechanics
Contact angle
Copper
Crystallography and Scattering Methods
Degassing of metals
Density
Electronic components industry
Heat resistant alloys
High temperature
Htc2009
Liquid alloys
Materials Science
Metals
Nickel
Polymer Sciences
Sessile drop method
Soldering
Solid Mechanics
Specialty metals industry
Substrates
Surface tension
Thermodynamic models
Thermodynamics
Tin
Tin base alloys
Wetting
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Summary:The density and the surface tension of binary Sn–Sb and ternary Sn–Sb–Cu liquid alloys have been measured over a wide temperature range by the sessile-drop method. The experimental data for the surface tension were analyzed by the Butler thermodynamic model. Investigations of the wetting behavior of these alloys on the Cu and Ni substrates in a vacuum were also performed.
ISSN:0022-2461
1573-4803
DOI:10.1007/s10853-009-4120-5