The Effect of Substrate Dissolution in Brazing CP-Ti and Ti-15-3 Using Clad Ti–15Cu–15Ni Filler

The effect of substrate dissolution in brazing CP-Ti and Ti-15-3 using Ti–15Cu–15Ni filler metal has been performed in the experiment. Microstructures of infrared brazed joints are strongly related to dissolution of substrate during brazing. For the 1800 s brazed CP-Ti specimen, the depletion of Cu...

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Bibliographic Details
Published in:ISIJ International 2010/03/15, Vol.50(3), pp.450-454
Main Authors: Wu, Z.Y., Yeh, T. Y., Shiue, R. K., Chang, C. S.
Format: Article
Language:English
Subjects:
Applied sciences
Brazed joints
Brazing
Brazing. Soldering
Cladding
Copper
CP-Ti
Depletion
Dissolution
Eutectoid temperature
Exact sciences and technology
Filler metal
Fillers
Infrared
Infrared brazing
Joining, thermal cutting: metallurgical aspects
Metals. Metallurgy
Microstructure
Nickel
TEM
Ti-15-3
Titanium
Titanium base alloys
Transformations
Vanadium base alloys
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Summary:The effect of substrate dissolution in brazing CP-Ti and Ti-15-3 using Ti–15Cu–15Ni filler metal has been performed in the experiment. Microstructures of infrared brazed joints are strongly related to dissolution of substrate during brazing. For the 1800 s brazed CP-Ti specimen, the depletion of Cu and Ni from the braze alloy into substrate cause eutectoid transformation of β-Ti into lamellar Ti2Cu and α-Ti. In contrast, dissolution of Ti-15-3 substrate into the molten braze during infrared brazing results in the 1800 s brazed zone alloyed with V, stabilizing the β-Ti to room temperature.
ISSN:0915-1559
1347-5460
DOI:10.2355/isijinternational.50.450