Evaluation of filling behavior on UV nanoimprint lithography using release coating

Ultra violet nanoimprint lithography (UV-NIL), which is able to obtain the nano-scale pattern effectively and quickly, is strongly desired for the next-generation lithography technology. However, it is well known that the higher viscosity UV-curable resin with UV-NIL tends to be the shorter obtained...

Full description

Saved in:
Bibliographic Details
Published in:Microelectronic engineering 2010-05, Vol.87 (5), p.918-921
Main Authors: Osari, Kazutomo, Unno, Noriyuki, Taniguchi, Jun, Machinaga, Ken-ichi, Ohsaki, Takeshi, Sakai, Nobuji
Format: Article
Language:English
Subjects:
Applied sciences
Contact angle
Cross-disciplinary physics: materials science
rheology
Electronics
Exact sciences and technology
Hydrogen silsesquioxane (HSQ)
Kinetic viscosity
Lithography
Materials science
Metals. Metallurgy
Methods of nanofabrication
Microelectronic fabrication (materials and surfaces technology)
Molds
Nanocomposites
Nanoimprint lithography (NIL)
Nanolithography
Nanomaterials
Nanoscale pattern formation
Nanostructure
Physics
Polymers
Production techniques
Release coatings
Resins
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Surface treatment
UV photocurable resin
Citations: Items that this one cites
Items that cite this one
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:Ultra violet nanoimprint lithography (UV-NIL), which is able to obtain the nano-scale pattern effectively and quickly, is strongly desired for the next-generation lithography technology. However, it is well known that the higher viscosity UV-curable resin with UV-NIL tends to be the shorter obtained pattern without the sufficient transfer pressure. This phenomenon is caused by the filling behavior of UV-curable resin into the UV-NIL mold, thus, the investigation of the filling behavior is very important. In this study, the filling behavior in UV-NIL was observed by using a “midair structure mold”, which is able to eliminate the bubble defect. As a result, it is clear that the filling behavior with low transfer pressure was depended on the capillary force in the mold pattern, which is described by the mold aperture size, the mold surface condition and the resin property.
ISSN:0167-9317
1873-5568
DOI:10.1016/j.mee.2009.11.175