Improved geometry of double-sided polished parallel wafers prepared for direct wafer bonding

Optical technological applications have upgraded polishing, including flat-surface polishing, to an extremely high level of geometrical precision. We deal with the application of this type of precision technology for the preparation of, e.g., silicon or fused-silica wafers that are thin compared to...

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Bibliographic Details
Published in:Applied optics (2004) 1994-12, Vol.33 (34), p.7945-7954
Main Authors: Haisma, J, van der Kruis, F J, Spierings, B A, Baalbergen, J J, Bijsterveld, B H, Brehm, R, Faasen, J H, Groenen, J J, de Haas, P W, Haddeman, T B, Michielsen, T M, Vijfvinkel, J
Format: Article
Language:English
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Summary:Optical technological applications have upgraded polishing, including flat-surface polishing, to an extremely high level of geometrical precision. We deal with the application of this type of precision technology for the preparation of, e.g., silicon or fused-silica wafers that are thin compared to their diameter. To this end a standard optical polishing process using a double-sided polishing machine was modified by giving the polishing pad holder an adaptable curvature. By carefully choosing the process conditions 10-cm-diameter silicon and fused-silica wafers (500-µm thickness) were obtained with a very small deviation from parallelism in the 0.01-µm range. The level of smoothness, surface and subsurface damage, was identical with that required for integrated-circuit processing.
ISSN:1559-128X
DOI:10.1364/AO.33.007945