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Reducing vortex density in superconductors using the 'ratchet effect'

A serious obstacle impeding the application of low- and high-temperature superconductor devices is the presence of trapped magnetic flux,: flux lines or vortices can be induced by fields as small as the Earth's magnetic field. Once present, vortices dissipate energy and generate internal noise,...

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Bibliographic Details
Published in:Nature (London) 1999-07, Vol.400 (6742), p.337-340
Main Authors: Barabási, A.-L, Lee, C.-S, Jankó, B, Derényi, I
Format: Article
Language:English
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Summary:A serious obstacle impeding the application of low- and high-temperature superconductor devices is the presence of trapped magnetic flux,: flux lines or vortices can be induced by fields as small as the Earth's magnetic field. Once present, vortices dissipate energy and generate internal noise, limiting the operation of numerous superconducting devices,. Methods used to overcome this difficulty include the pinning of vortices by the incorporation of impurities and defects, the construction of flux 'dams', slots and holes, and magnetic shields, which block the penetration of new flux lines in the bulk of the superconductor or reduce the magnetic field in the immediate vicinity of the superconducting device. The most desirable method would be to remove the vortices from the bulk of the superconductor, but there was hitherto no known phenomenon that could form the basis for such a process. Here we show that the application of analternating current to a superconductor patterned with an asymmetric pinning potential can induce vortex motion whose direction is determined only by the asymmetry of the pattern. The mechanism responsible for this phenomenon is the so-called 'ratchet effect', and its working principle applies to both low- and high-temperature superconductors. We demonstrate theoretically that, with an appropriate choice of pinning potential, the ratchet effect can be used to remove vortices from low-temperature superconductors in the parameter range required for various applications.
ISSN:0028-0836
1476-4687
DOI:10.1038/22485