Influence of Die Attach Layer on Thermal Performance of High Power Light Emitting Diodes

In this paper, the influence of the die attach adhesive (DAA) layer on the thermal performance of high power light emitting diodes was first investigated by using finite element analysis, and some key results were verified by the experimental data. Effective thermal management of the studied light e...

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Bibliographic Details
Published in:IEEE transactions on components and packaging technologies 2010-12, Vol.33 (4), p.722-727
Main Authors: Yan, B, Jiun Pyng You, Tran, N T, Yongzhi He, Shi, F G
Format: Article
Language:English
Subjects:
Adhesive strength
Bonding
Conducting materials
Die attach material
finite element analysis
Finite element methods
Geometry
Heat transfer
Light emitting diodes
Mathematical analysis
Microassembly
Packages
Packaging
Performance analysis
Thermal conductivity
Thermal management
thermal performance
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Summary:In this paper, the influence of the die attach adhesive (DAA) layer on the thermal performance of high power light emitting diodes was first investigated by using finite element analysis, and some key results were verified by the experimental data. Effective thermal management of the studied light emitting diode package can be achieved by selecting a DAA material with a proper thermal conductivity and by manipulating the geometry parameters of the DAA layer, such as the DAA area, and the bond-line thickness. The significance of DAA thermal conductivity to heat dissipation was further demonstrated by an analysis of the bottleneck to heat transfer.
ISSN:1521-3331
1557-9972
DOI:10.1109/TCAPT.2009.2032097