A three-dimensional heat sink module design problem with experimental verification

A three-dimensional heat sink module design problem is examined in this work to estimate the optimum design variables using the Levenberg–Marquardt Method (LMM) and a general purpose commercial code CFD-ACE+. Three different types of heat sinks are designed based on the original fin arrays with a fi...

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Bibliographic Details
Published in:International journal of heat and mass transfer 2011-03, Vol.54 (7-8), p.1482-1492
Main Authors: Huang, Cheng-Hung, Lu, Jon-Jer, Ay, Herchang
Format: Article
Language:English
Subjects:
Applied sciences
Arrays
Design. Technologies. Operation analysis. Testing
Electronics
Exact sciences and technology
Heat sink module design
Heat sinks
Integrated circuits
Levenberg-Marquardt Method
Mass transfer
Mathematical analysis
Mathematical models
Modules
Optimization
Optimum design
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Solvents
Uranium
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Summary:A three-dimensional heat sink module design problem is examined in this work to estimate the optimum design variables using the Levenberg–Marquardt Method (LMM) and a general purpose commercial code CFD-ACE+. Three different types of heat sinks are designed based on the original fin arrays with a fixed volume. The objective of this study is to minimize the maximum temperature in the fin array and to determine the best shape of heat sink. Results obtained by using the LMM to solve this 3-D heat sink module design problem are firstly justified based on the numerical experiments and it is concluded that for all three cases, the optimum fin height H tends to become higher and optimum fin thickness W tends to become thinner than the original fin array, as a result both the fin pitch D and heat sink base thickness U are increased. The maximum temperature for the designed fin array can be decreased drastically by utilizing the present fin design algorithm. Finally, temperature distributions for the optimal heat sink modules are measured using thermal camera and compared with the numerical solutions to justify the validity of the present design.
ISSN:0017-9310
1879-2189
DOI:10.1016/j.ijheatmasstransfer.2010.11.044