Soldering of Bi-2223/Ag high temperature superconducting tapes with Sn–Pb–Bi–Ag alloy paste

Soldered joints of Bi-2223/Ag-sheathed high temperature superconducting multifilamentary tapes were fabricated using 63 wt.%Sn–34 wt.%Pb–1 wt.%Bi–2 wt.%Ag paste. The soldered joints were observed by scanning electron microscope (SEM) and X-ray diffraction (XRD). Moreover, the electrical properties o...

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Bibliographic Details
Published in:Physica. C, Superconductivity Superconductivity, 2010-01, Vol.470 (2), p.115-119
Main Authors: Wei, Guo, Guisheng, Zou, Aiping, Wu, Hailin, Bai, Jialie, Ren
Format: Article
Language:English
Subjects:
Applied sciences
Bi-2223/Ag
CCR
Electrical engineering. Electrical power engineering
ELEVATED TEMPERATURE
Exact sciences and technology
JOINTS
Materials
Microstructure
PASTES
Resistance
SCANNING ELECTRON MICROSCOPY
Sheaths
Silver
Solder
Soldered joints
Superconducting tapes
SUPERCONDUCTIVITY
SUPERCONDUCTORS
TAPE
TENSILE STRENGTH
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Summary:Soldered joints of Bi-2223/Ag-sheathed high temperature superconducting multifilamentary tapes were fabricated using 63 wt.%Sn–34 wt.%Pb–1 wt.%Bi–2 wt.%Ag paste. The soldered joints were observed by scanning electron microscope (SEM) and X-ray diffraction (XRD). Moreover, the electrical properties of joints were evaluated by current–voltage curves, and the tensile strengths of the joints were also tested. The results show that the soldered joint consists of Ag sheath – Ag 3Sn compound layer – PbSn 2 and Ag 3Sn solder layer – Ag 3Sn compound layer – Ag sheath. The joints are obeyed with Ohms Law and the magnitude of the joint resistance, which deceases with the increase of the overlap length, can reach the order of 10 −8 Ω. The tensile strength of the joints with a brittle fracture mode is a little lower than that of the original tapes.
ISSN:0921-4534
1873-2143
DOI:10.1016/j.physc.2009.11.045