Evaluation of Next Generation Fluids for ArF Immersion Lithography Beyond Water

Optical immersion lithography using fluids with refractive indices greater than that of water (1.44) can enable numerical apertures of 1.55 or above for printing sub-45 nm lines. We continue to work on delivering second generation high index immersion fluid technology to extend immersion lithography...

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Bibliographic Details
Published in:Journal of Photopolymer Science and Technology 2007, Vol.20(5), pp.729-738
Main Authors: Tran, Hoang, French, Roger H., Adelman, Douglas J., Feldman, Jerald, Qiu, Weiming, Wheland, Robert C., Brubaker, Luke W., Fischel, Brian E., Fones, Barbara B., Lemon, Michael F., Yang, Min K., Nagao, Osami, Kaku, Mureo, Mocella, Michael, Schmieg, John J.
Format: Article
Language:English
Subjects:
absorbance
active recycle
Computational fluid dynamics
defectivity
Fluid flow
fluid handling
Fluids
hydrocarbons
Immersion
immersion lithography
leaching
Lithography
Mathematical models
particle contamination
radiation durability
refractive index
Refractivity
resist/fluid interactions
Resists
second generation fluid
third generation fluid
window contamination
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Summary:Optical immersion lithography using fluids with refractive indices greater than that of water (1.44) can enable numerical apertures of 1.55 or above for printing sub-45 nm lines. We continue to work on delivering second generation high index immersion fluid technology to extend immersion lithography. Several fluids have been optimized to meet the required specifications of refractive index (n ≥ 1.64) and absorbance (< 0.10 / cm) at 193 nm. Here, we report on recent processing studies on two of our leading fluid candidates, designated IF132 and IF169. We are developing methods to ensure reproducible, low-absorbance fluid with low particle counts. We have also studied fluid changes on exposure to 193nm laser irradiation, and have quantified both photobleaching and photodarkening processes as a function of a number of fluid and process parameters. Through the development of a Standard Stepper Tool model, we are able to correlate our test system results to those expected in a commercial exposure system. Finally, studies of fluid-resist interactions - including PAG leaching measurements, resist thickness changes, and resist surface residues and defects - are providing valuable information on fluid compatibility with 193nm photoresists, and the effects of fluid purity on such interactions.
ISSN:0914-9244
1349-6336
1349-6336
DOI:10.2494/photopolymer.20.729