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Correlation between surface damage and micro-defects in Si covered with insulating layer by implantation of He and H ions

Cz n-type Si (100) wafers covered with a 220 nm SiO 2 layer or a 170 nm Si 3N 4 layer were singly implanted with 160 keV He ions at a dose of 5 × 10 16/cm 2 or successively implanted with 160 keV He ions at a dose of 5 × 10 16/cm 2 and 110 keV H ions at a dose of 1 × 10 16/cm 2. Surface morphologies...

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Published in:Thin solid films 2011-03, Vol.519 (10), p.3162-3168
Main Authors: Liu, C.L., Li, M.K., Wang, Z., Gao, Y.J., Liao, J.Q., Zhang, D.C., Zhang, X.L., Shen, Y.Y.
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cited_by cdi_FETCH-LOGICAL-c359t-633eaa905e0d3c281ec6e83f88d6db726ae5b0a98c713352931b2d7e7f9b63a73
cites cdi_FETCH-LOGICAL-c359t-633eaa905e0d3c281ec6e83f88d6db726ae5b0a98c713352931b2d7e7f9b63a73
container_end_page 3168
container_issue 10
container_start_page 3162
container_title Thin solid films
container_volume 519
creator Liu, C.L.
Li, M.K.
Wang, Z.
Gao, Y.J.
Liao, J.Q.
Zhang, D.C.
Zhang, X.L.
Shen, Y.Y.
description Cz n-type Si (100) wafers covered with a 220 nm SiO 2 layer or a 170 nm Si 3N 4 layer were singly implanted with 160 keV He ions at a dose of 5 × 10 16/cm 2 or successively implanted with 160 keV He ions at a dose of 5 × 10 16/cm 2 and 110 keV H ions at a dose of 1 × 10 16/cm 2. Surface morphologies together with defect microstructures have been studied by means of several techniques, including optical microscopy, atomic force microscopy, and cross-sectional transmission electron microscopy (XTEM). Only surface blistering has been observed for He and H sequentially implanted SiO 2/Si samples after annealing in temperature range up to 1000 °C. However, as for the He and H implanted Si 3N 4/Si samples, surface features including blistering and the localized exfoliation of both the top Si 3N 4 layer and the implanted Si layer have been well demonstrated during subsequent annealing. XTEM observations reveal quite different defect morphologies in two kinds of materials under the same implantation and annealing conditions. The possible mechanisms of surface damage in two kinds of materials have been discussed and presented based on the XTEM results.
doi_str_mv 10.1016/j.tsf.2011.01.101
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fullrecord <record><control><sourceid>proquest_cross</sourceid><recordid>TN_cdi_proquest_miscellaneous_869802735</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><els_id>S0040609011001441</els_id><sourcerecordid>869802735</sourcerecordid><originalsourceid>FETCH-LOGICAL-c359t-633eaa905e0d3c281ec6e83f88d6db726ae5b0a98c713352931b2d7e7f9b63a73</originalsourceid><addsrcrecordid>eNp9kE1v1DAQhi1UJLaFH8DNF9RTlrHdJLY4VSvaRarEAThbE3tcvMrHYmdb7b_HUVYcOVl-9c5jz8PYRwFbAaL5fNjOOWwlCLEFsURv2Ebo1lSyVeKKbQDuoGrAwDt2nfMBAISUasPOuykl6nGO08g7ml-JRp5PKaAj7nHAZ-I4ej5El6bKUyA3Zx5H_iNyN71QIs9f4_y7RPm0YMZn3uOZEu_OPA7HHsd5hU-B71fWnpd7fs_eBuwzfbicN-zXw9efu3319P3x2-7-qXKqNnPVKEWIBmoCr5zUglxDWgWtfeO7VjZIdQdotGuFUrU0SnTSt9QG0zUKW3XDblfuMU1_TpRnO8TsqC8_o-mUrW6MhmKpLk2xNsuqOScK9pjigOlsBdjFsj3YYtkuli2IJSozny50zA77kHB0Mf8blHegWqFN6X1Ze1RWfYmUbHaRRkc-pqLU-in-55W_VBGTIg</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>869802735</pqid></control><display><type>article</type><title>Correlation between surface damage and micro-defects in Si covered with insulating layer by implantation of He and H ions</title><source>ScienceDirect Freedom Collection</source><creator>Liu, C.L. ; Li, M.K. ; Wang, Z. ; Gao, Y.J. ; Liao, J.Q. ; Zhang, D.C. ; Zhang, X.L. ; Shen, Y.Y.</creator><creatorcontrib>Liu, C.L. ; Li, M.K. ; Wang, Z. ; Gao, Y.J. ; Liao, J.Q. ; Zhang, D.C. ; Zhang, X.L. ; Shen, Y.Y.</creatorcontrib><description>Cz n-type Si (100) wafers covered with a 220 nm SiO 2 layer or a 170 nm Si 3N 4 layer were singly implanted with 160 keV He ions at a dose of 5 × 10 16/cm 2 or successively implanted with 160 keV He ions at a dose of 5 × 10 16/cm 2 and 110 keV H ions at a dose of 1 × 10 16/cm 2. Surface morphologies together with defect microstructures have been studied by means of several techniques, including optical microscopy, atomic force microscopy, and cross-sectional transmission electron microscopy (XTEM). Only surface blistering has been observed for He and H sequentially implanted SiO 2/Si samples after annealing in temperature range up to 1000 °C. However, as for the He and H implanted Si 3N 4/Si samples, surface features including blistering and the localized exfoliation of both the top Si 3N 4 layer and the implanted Si layer have been well demonstrated during subsequent annealing. XTEM observations reveal quite different defect morphologies in two kinds of materials under the same implantation and annealing conditions. The possible mechanisms of surface damage in two kinds of materials have been discussed and presented based on the XTEM results.</description><identifier>ISSN: 0040-6090</identifier><identifier>EISSN: 1879-2731</identifier><identifier>DOI: 10.1016/j.tsf.2011.01.101</identifier><identifier>CODEN: THSFAP</identifier><language>eng</language><publisher>Amsterdam: Elsevier B.V</publisher><subject>Annealing ; Blistering ; Condensed matter: structure, mechanical and thermal properties ; Covering ; Damage ; Defect microstructures ; Defects and impurities in crystals; microstructure ; Doping and impurity implantation in other materials ; Exact sciences and technology ; Helium and hydrogen ion implantation ; Implantation ; Localized exfoliation ; Morphology ; Physics ; Silicon ; Silicon dioxide ; Silicon nitride ; SiO 2/Si and Si 3N 4/Si ; Structure and morphology; thickness ; Structure of solids and liquids; crystallography ; Surface blistering ; Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties) ; Thin film structure and morphology ; Transmission electron microscopy</subject><ispartof>Thin solid films, 2011-03, Vol.519 (10), p.3162-3168</ispartof><rights>2011 Elsevier B.V.</rights><rights>2015 INIST-CNRS</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c359t-633eaa905e0d3c281ec6e83f88d6db726ae5b0a98c713352931b2d7e7f9b63a73</citedby><cites>FETCH-LOGICAL-c359t-633eaa905e0d3c281ec6e83f88d6db726ae5b0a98c713352931b2d7e7f9b63a73</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>314,776,780,27903,27904</link.rule.ids><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&amp;idt=24037189$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>Liu, C.L.</creatorcontrib><creatorcontrib>Li, M.K.</creatorcontrib><creatorcontrib>Wang, Z.</creatorcontrib><creatorcontrib>Gao, Y.J.</creatorcontrib><creatorcontrib>Liao, J.Q.</creatorcontrib><creatorcontrib>Zhang, D.C.</creatorcontrib><creatorcontrib>Zhang, X.L.</creatorcontrib><creatorcontrib>Shen, Y.Y.</creatorcontrib><title>Correlation between surface damage and micro-defects in Si covered with insulating layer by implantation of He and H ions</title><title>Thin solid films</title><description>Cz n-type Si (100) wafers covered with a 220 nm SiO 2 layer or a 170 nm Si 3N 4 layer were singly implanted with 160 keV He ions at a dose of 5 × 10 16/cm 2 or successively implanted with 160 keV He ions at a dose of 5 × 10 16/cm 2 and 110 keV H ions at a dose of 1 × 10 16/cm 2. Surface morphologies together with defect microstructures have been studied by means of several techniques, including optical microscopy, atomic force microscopy, and cross-sectional transmission electron microscopy (XTEM). Only surface blistering has been observed for He and H sequentially implanted SiO 2/Si samples after annealing in temperature range up to 1000 °C. However, as for the He and H implanted Si 3N 4/Si samples, surface features including blistering and the localized exfoliation of both the top Si 3N 4 layer and the implanted Si layer have been well demonstrated during subsequent annealing. XTEM observations reveal quite different defect morphologies in two kinds of materials under the same implantation and annealing conditions. The possible mechanisms of surface damage in two kinds of materials have been discussed and presented based on the XTEM results.</description><subject>Annealing</subject><subject>Blistering</subject><subject>Condensed matter: structure, mechanical and thermal properties</subject><subject>Covering</subject><subject>Damage</subject><subject>Defect microstructures</subject><subject>Defects and impurities in crystals; microstructure</subject><subject>Doping and impurity implantation in other materials</subject><subject>Exact sciences and technology</subject><subject>Helium and hydrogen ion implantation</subject><subject>Implantation</subject><subject>Localized exfoliation</subject><subject>Morphology</subject><subject>Physics</subject><subject>Silicon</subject><subject>Silicon dioxide</subject><subject>Silicon nitride</subject><subject>SiO 2/Si and Si 3N 4/Si</subject><subject>Structure and morphology; thickness</subject><subject>Structure of solids and liquids; crystallography</subject><subject>Surface blistering</subject><subject>Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties)</subject><subject>Thin film structure and morphology</subject><subject>Transmission electron microscopy</subject><issn>0040-6090</issn><issn>1879-2731</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2011</creationdate><recordtype>article</recordtype><recordid>eNp9kE1v1DAQhi1UJLaFH8DNF9RTlrHdJLY4VSvaRarEAThbE3tcvMrHYmdb7b_HUVYcOVl-9c5jz8PYRwFbAaL5fNjOOWwlCLEFsURv2Ebo1lSyVeKKbQDuoGrAwDt2nfMBAISUasPOuykl6nGO08g7ml-JRp5PKaAj7nHAZ-I4ej5El6bKUyA3Zx5H_iNyN71QIs9f4_y7RPm0YMZn3uOZEu_OPA7HHsd5hU-B71fWnpd7fs_eBuwzfbicN-zXw9efu3319P3x2-7-qXKqNnPVKEWIBmoCr5zUglxDWgWtfeO7VjZIdQdotGuFUrU0SnTSt9QG0zUKW3XDblfuMU1_TpRnO8TsqC8_o-mUrW6MhmKpLk2xNsuqOScK9pjigOlsBdjFsj3YYtkuli2IJSozny50zA77kHB0Mf8blHegWqFN6X1Ze1RWfYmUbHaRRkc-pqLU-in-55W_VBGTIg</recordid><startdate>20110301</startdate><enddate>20110301</enddate><creator>Liu, C.L.</creator><creator>Li, M.K.</creator><creator>Wang, Z.</creator><creator>Gao, Y.J.</creator><creator>Liao, J.Q.</creator><creator>Zhang, D.C.</creator><creator>Zhang, X.L.</creator><creator>Shen, Y.Y.</creator><general>Elsevier B.V</general><general>Elsevier</general><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SR</scope><scope>7U5</scope><scope>8BQ</scope><scope>8FD</scope><scope>JG9</scope><scope>L7M</scope></search><sort><creationdate>20110301</creationdate><title>Correlation between surface damage and micro-defects in Si covered with insulating layer by implantation of He and H ions</title><author>Liu, C.L. ; Li, M.K. ; Wang, Z. ; Gao, Y.J. ; Liao, J.Q. ; Zhang, D.C. ; Zhang, X.L. ; Shen, Y.Y.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c359t-633eaa905e0d3c281ec6e83f88d6db726ae5b0a98c713352931b2d7e7f9b63a73</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2011</creationdate><topic>Annealing</topic><topic>Blistering</topic><topic>Condensed matter: structure, mechanical and thermal properties</topic><topic>Covering</topic><topic>Damage</topic><topic>Defect microstructures</topic><topic>Defects and impurities in crystals; microstructure</topic><topic>Doping and impurity implantation in other materials</topic><topic>Exact sciences and technology</topic><topic>Helium and hydrogen ion implantation</topic><topic>Implantation</topic><topic>Localized exfoliation</topic><topic>Morphology</topic><topic>Physics</topic><topic>Silicon</topic><topic>Silicon dioxide</topic><topic>Silicon nitride</topic><topic>SiO 2/Si and Si 3N 4/Si</topic><topic>Structure and morphology; thickness</topic><topic>Structure of solids and liquids; crystallography</topic><topic>Surface blistering</topic><topic>Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties)</topic><topic>Thin film structure and morphology</topic><topic>Transmission electron microscopy</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Liu, C.L.</creatorcontrib><creatorcontrib>Li, M.K.</creatorcontrib><creatorcontrib>Wang, Z.</creatorcontrib><creatorcontrib>Gao, Y.J.</creatorcontrib><creatorcontrib>Liao, J.Q.</creatorcontrib><creatorcontrib>Zhang, D.C.</creatorcontrib><creatorcontrib>Zhang, X.L.</creatorcontrib><creatorcontrib>Shen, Y.Y.</creatorcontrib><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>Engineered Materials Abstracts</collection><collection>Solid State and Superconductivity Abstracts</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>Materials Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><jtitle>Thin solid films</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Liu, C.L.</au><au>Li, M.K.</au><au>Wang, Z.</au><au>Gao, Y.J.</au><au>Liao, J.Q.</au><au>Zhang, D.C.</au><au>Zhang, X.L.</au><au>Shen, Y.Y.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Correlation between surface damage and micro-defects in Si covered with insulating layer by implantation of He and H ions</atitle><jtitle>Thin solid films</jtitle><date>2011-03-01</date><risdate>2011</risdate><volume>519</volume><issue>10</issue><spage>3162</spage><epage>3168</epage><pages>3162-3168</pages><issn>0040-6090</issn><eissn>1879-2731</eissn><coden>THSFAP</coden><abstract>Cz n-type Si (100) wafers covered with a 220 nm SiO 2 layer or a 170 nm Si 3N 4 layer were singly implanted with 160 keV He ions at a dose of 5 × 10 16/cm 2 or successively implanted with 160 keV He ions at a dose of 5 × 10 16/cm 2 and 110 keV H ions at a dose of 1 × 10 16/cm 2. Surface morphologies together with defect microstructures have been studied by means of several techniques, including optical microscopy, atomic force microscopy, and cross-sectional transmission electron microscopy (XTEM). Only surface blistering has been observed for He and H sequentially implanted SiO 2/Si samples after annealing in temperature range up to 1000 °C. However, as for the He and H implanted Si 3N 4/Si samples, surface features including blistering and the localized exfoliation of both the top Si 3N 4 layer and the implanted Si layer have been well demonstrated during subsequent annealing. XTEM observations reveal quite different defect morphologies in two kinds of materials under the same implantation and annealing conditions. The possible mechanisms of surface damage in two kinds of materials have been discussed and presented based on the XTEM results.</abstract><cop>Amsterdam</cop><pub>Elsevier B.V</pub><doi>10.1016/j.tsf.2011.01.101</doi><tpages>7</tpages></addata></record>
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subjects Annealing
Blistering
Condensed matter: structure, mechanical and thermal properties
Covering
Damage
Defect microstructures
Defects and impurities in crystals
microstructure
Doping and impurity implantation in other materials
Exact sciences and technology
Helium and hydrogen ion implantation
Implantation
Localized exfoliation
Morphology
Physics
Silicon
Silicon dioxide
Silicon nitride
SiO 2/Si and Si 3N 4/Si
Structure and morphology
thickness
Structure of solids and liquids
crystallography
Surface blistering
Surfaces and interfaces
thin films and whiskers (structure and nonelectronic properties)
Thin film structure and morphology
Transmission electron microscopy
title Correlation between surface damage and micro-defects in Si covered with insulating layer by implantation of He and H ions
url http://sfxeu10.hosted.exlibrisgroup.com/loughborough?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-23T12%3A18%3A53IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_cross&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Correlation%20between%20surface%20damage%20and%20micro-defects%20in%20Si%20covered%20with%20insulating%20layer%20by%20implantation%20of%20He%20and%20H%20ions&rft.jtitle=Thin%20solid%20films&rft.au=Liu,%20C.L.&rft.date=2011-03-01&rft.volume=519&rft.issue=10&rft.spage=3162&rft.epage=3168&rft.pages=3162-3168&rft.issn=0040-6090&rft.eissn=1879-2731&rft.coden=THSFAP&rft_id=info:doi/10.1016/j.tsf.2011.01.101&rft_dat=%3Cproquest_cross%3E869802735%3C/proquest_cross%3E%3Cgrp_id%3Ecdi_FETCH-LOGICAL-c359t-633eaa905e0d3c281ec6e83f88d6db726ae5b0a98c713352931b2d7e7f9b63a73%3C/grp_id%3E%3Coa%3E%3C/oa%3E%3Curl%3E%3C/url%3E&rft_id=info:oai/&rft_pqid=869802735&rft_id=info:pmid/&rfr_iscdi=true