LTCC Packages With Embedded Phased-Array Antennas for 60 GHz Communications

• Published in: IEEE microwave and wireless components letters 2011-03, Vol.21 (3), p.142-144
• Main Authors: Dong Gun Kam, Duixian Liu, Natarajan, A, Reynolds, S, Ho-Chung Chen, Floyd, B A
• Format: Article
• Language: English
• Subjects: 60 GHz; Antenna arrays; Antenna measurements; Antenna-in-package; Antennas; Applied sciences; Arrays; Boards; Ceramics; Channels; Design. Technologies. Operation analysis. Testing; Electronics; Exact sciences and technology; Integrated circuit modeling; Integrated circuits; Materials; Microwave antennas; Microwaves; millimeter-wave package; Packages; phased-array antennas; Radiocommunications; Receivers; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices; Solid modeling; Telecommunications; Telecommunications and information theory; Transmitters; Transmitters. Receivers
• ISSN: 1531-1309; 2771-957X; 1558-1764; 2771-9588
• DOI: 10.1109/LMWC.2010.2103932

A low-cost, fully-integrated antenna-in-package solution for 60 GHz phased-array systems is demonstrated. Sixteen patch antennas are integrated into a 28 mm × 28 mm ball grid array together with a flip-chip attached transmitter or receiver IC. The packages have been implemented using low temperature co-fired ceramic technology. 60 GHz interconnects, including flip-chip transitions and via structures, are optimized using full-wave simulation. Anechoic chamber measurement has shown ~ 5 dBi unit antenna gain across all four IEEE 802.15.3c channels, achieving excellent model-to-hardware correlation. The packaged transmitter and receiver ICs, mounted on evaluation boards, have demonstrated beam-steered, non-line-of-sight links with data rates up to 5.3 Gb/s.