Active Packaging Method for Light-Emitting Diode Lamps With Photosensitive Epoxy Resins

A novel active light-emitting diode (LED) packaging method is presented. Our method utilizes the emission from the LED chip itself to package the LED with photosensitive epoxy. Such a photon-induced polymerization method, leading to the formation of specific lamp shapes and characteristics, eliminat...

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Bibliographic Details
Published in:IEEE photonics technology letters 2008-01, Vol.20 (2), p.87-89
Main Authors: Wang, Hao, Lee, Kyu-Seung, Ryu, Jae-Hyoung, Hong, Chang-Hee, Cho, Yong-Hoon
Format: Article
Language:English
Subjects:
Active control
Bonding
Curing
Electronic packaging thermal management
Emission
Encapsulation
Epoxy resins
Lamps
LED lamps
Light emitting diodes
light-emitting diode (LED)
Molds
Organic light emitting diodes
Packages
Packaging
photosensitive epoxy resins
Polymerization
Polymers
Semiconductor device packaging
Shape
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Description
Summary:A novel active light-emitting diode (LED) packaging method is presented. Our method utilizes the emission from the LED chip itself to package the LED with photosensitive epoxy. Such a photon-induced polymerization method, leading to the formation of specific lamp shapes and characteristics, eliminates the utilization of the mold. By controlling the packaging parameters, for example, the polymerization current and the polymerization time, the emission properties of the LED lamps can be controlled. It is found that the self-focusing effect plays an important role in the active packaging process.
ISSN:1041-1135
1941-0174
DOI:10.1109/LPT.2007.910760