Robust Design of Third-Level Packaging in Portable Electronics: Solder Joint Reliability Under Dynamic Mechanical Loading

Solder joint reliability issues that can be identified only at the system level are notoriously difficult to resolve in a timely manner using trial and error experimentation alone. The particular case of solder joint reliability of a side switch in a phone subjected to drop-impact is addressed. An a...

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Bibliographic Details
Published in:IEEE transactions on components and packaging technologies 2009-06, Vol.32 (2), p.396-404
Main Author: Canumalla, S.
Format: Article
Language:English
Subjects:
Capacitive sensors
Design engineering
Dynamic loading
Dynamics
Electronics
Electronics industry
Electronics packaging
Errors
Experimentation
Industrial electronics
Loads (forces)
Monte Carlo simulation
Packaging
Packaging machines
reliability
Response surface methodology
robust design
Robustness
solder joint
Soldering
Solders
Springs
Switches
third-level package
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Summary:Solder joint reliability issues that can be identified only at the system level are notoriously difficult to resolve in a timely manner using trial and error experimentation alone. The particular case of solder joint reliability of a side switch in a phone subjected to drop-impact is addressed. An approach employing Response Surface Methodology (RSM) is proposed to solve reliability and robust design problems in advanced packaging. A 10x improvement in the drop test failure rate is demonstrated with a minimum of trial and error experimentation. Technical contributions are a) a novel drop life response function derived from strain energy principles, and b) an approach to address package reliability issues at the system level.
ISSN:1521-3331
1557-9972
DOI:10.1109/TCAPT.2009.2014258