Efficient Distributed On-Chip Decoupling Capacitors for Nanoscale ICs

A distributed on-chip decoupling capacitor network is proposed in this paper. A system of distributed on-chip decoupling capacitors is shown to provide an efficient solution for providing the required on-chip decoupling capacitance under existing technology constraints. In a system of distributed on...

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Bibliographic Details
Published in:IEEE transactions on very large scale integration (VLSI) systems 2008-12, Vol.16 (12), p.1717-1721
Main Authors: Popovich, M., Friedman, E.G., Secareanu, R.M., Hartin, O.L.
Format: Article
Language:English
Subjects:
Applied sciences
Capacitors
Circuit simulation
Computational modeling
Coupling circuits
Decoupling
Decoupling capacitors
Design. Technologies. Operation analysis. Testing
Dielectric, amorphous and glass solid devices
Electrical engineering. Electrical power engineering
Electronic equipment and fabrication. Passive components, printed wiring boards, connectics
Electronics
Exact sciences and technology
Integrated circuit modeling
Integrated circuit noise
Integrated circuits
Nanocomposites
Nanomaterials
Nanostructure
Networks
power distribution systems
Power electronics, power supplies
power noise
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Simulation
Solid modeling
Solid state circuits
Very large scale integration
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Description
Summary:A distributed on-chip decoupling capacitor network is proposed in this paper. A system of distributed on-chip decoupling capacitors is shown to provide an efficient solution for providing the required on-chip decoupling capacitance under existing technology constraints. In a system of distributed on-chip decoupling capacitors, each capacitor is sized based on the parasitic impedance of the power distribution grid. Various tradeoffs in a system of distributed on-chip decoupling capacitors are also discussed. Related simulation results for typical values of on-chip parasitic resistance are also presented. The worst case error is 0.003% as compared to SPICE.
ISSN:1063-8210
1557-9999
DOI:10.1109/TVLSI.2008.2001735