Silver nanoplates as inkjet ink particles for metallization at a low baking temperature of 100 °C

[Display omitted] ► Conductive lines are successfully fabricated by printing Ag nanoplates and baking at 100 °C. ► Sintering on these nanoplates at 100 °C led to the formation of connections. ► The resistivity of the line obtained by printing nanoplates is 26.3 μΩ-cm. Conductive patterns on a flexib...

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Bibliographic Details
Published in:Colloids and surfaces. A, Physicochemical and engineering aspects Physicochemical and engineering aspects, 2011-05, Vol.381 (1), p.85-91
Main Authors: Lee, Chien-Liang, Chang, Kun-Chuan, Syu, Ciou-Mei
Format: Article
Language:English
Subjects:
Baking
colloids
Electroless
Inkjet printing
Nanocomposites
Nanomaterials
Nanoparticle
Nanoparticles
Nanostructure
Printing
Silver
Sintering
temperature
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Summary:[Display omitted] ► Conductive lines are successfully fabricated by printing Ag nanoplates and baking at 100 °C. ► Sintering on these nanoplates at 100 °C led to the formation of connections. ► The resistivity of the line obtained by printing nanoplates is 26.3 μΩ-cm. Conductive patterns on a flexible polyimide film using Ag nanoplate ink of 10 wt% solid content were successfully fabricated by inkjet printing and baking at a low temperature of 100 °C. Sintering on these printed nanoplates at a low temperature (100 °C) led to the formation of connections between nanoplates. A four-point probe measurement indicated that the resistivity of the line obtained by printing nanoplates is 26.3 μΩ-cm and this is lower than that of the line obtained by printing spherical nanoparticles, 4.3 × 10 5 μΩ-cm.
ISSN:0927-7757
1873-4359
DOI:10.1016/j.colsurfa.2011.03.034