Loading…
Silver nanoplates as inkjet ink particles for metallization at a low baking temperature of 100 °C
[Display omitted] ► Conductive lines are successfully fabricated by printing Ag nanoplates and baking at 100 °C. ► Sintering on these nanoplates at 100 °C led to the formation of connections. ► The resistivity of the line obtained by printing nanoplates is 26.3 μΩ-cm. Conductive patterns on a flexib...
Saved in:
| Published in: | Colloids and surfaces. A, Physicochemical and engineering aspects Physicochemical and engineering aspects, 2011-05, Vol.381 (1), p.85-91 |
|---|---|
| Main Authors: | , , |
| Format: | Article |
| Language: | English |
| Subjects: | |
| Citations: | Items that this one cites Items that cite this one |
| Online Access: | Get full text |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| cited_by | cdi_FETCH-LOGICAL-c283t-f3c2db797288ba20500b5a72b0b5c64c0015cfa63d0eb2fb178943bb6f24060e3 |
|---|---|
| cites | cdi_FETCH-LOGICAL-c283t-f3c2db797288ba20500b5a72b0b5c64c0015cfa63d0eb2fb178943bb6f24060e3 |
| container_end_page | 91 |
| container_issue | 1 |
| container_start_page | 85 |
| container_title | Colloids and surfaces. A, Physicochemical and engineering aspects |
| container_volume | 381 |
| creator | Lee, Chien-Liang Chang, Kun-Chuan Syu, Ciou-Mei |
| description | [Display omitted]
► Conductive lines are successfully fabricated by printing Ag nanoplates and baking at 100
°C. ► Sintering on these nanoplates at 100
°C led to the formation of connections. ► The resistivity of the line obtained by printing nanoplates is 26.3
μΩ-cm.
Conductive patterns on a flexible polyimide film using Ag nanoplate ink of 10
wt% solid content were successfully fabricated by inkjet printing and baking at a low temperature of 100
°C. Sintering on these printed nanoplates at a low temperature (100
°C) led to the formation of connections between nanoplates. A four-point probe measurement indicated that the resistivity of the line obtained by printing nanoplates is 26.3
μΩ-cm and this is lower than that of the line obtained by printing spherical nanoparticles, 4.3
×
10
5
μΩ-cm. |
| doi_str_mv | 10.1016/j.colsurfa.2011.03.034 |
| format | article |
| fullrecord | <record><control><sourceid>proquest_cross</sourceid><recordid>TN_cdi_proquest_miscellaneous_880659099</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><els_id>S0927775711001981</els_id><sourcerecordid>880659099</sourcerecordid><originalsourceid>FETCH-LOGICAL-c283t-f3c2db797288ba20500b5a72b0b5c64c0015cfa63d0eb2fb178943bb6f24060e3</originalsourceid><addsrcrecordid>eNqFkN2KFDEQhYMoOK6-gubOqx4rSXen-04Z_IMFL9a9DpVMZclsptMmmRV9Kp_BJzPD6LVQcKD4Tv0cxl4K2AoQ45vD1qVYTtnjVoIQW1Ct-kdsIyatul4N82O2gVnqTutBP2XPSjkAQD_oecPsTYgPlPmCS1ojViocCw_L_YHqWfiKuQYXW9-nzI9UMcbwE2tIC8fKkcf0nVu8D8sdr3RcKWM9ZeLJcwHAf__aPWdPPMZCL_7qFbv98P7r7lN3_eXj5927687JSdXOKyf3Vs9aTpNFCQOAHVBL28SNvQMQg_M4qj2Qld4KPc29snb0socRSF2x15e5a07fTlSqOYbiKEZcKJ2KmSYYhxnmuZHjhXQ5lZLJmzWHI-YfRoA5Z2oO5l-m5pypAdWqb8ZXF6PHZPAuh2JubxrQbhVayOFMvL0Q1D59CJRNcYEWR_uQyVWzT-F_S_4A1t-NnA</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>880659099</pqid></control><display><type>article</type><title>Silver nanoplates as inkjet ink particles for metallization at a low baking temperature of 100 °C</title><source>Elsevier</source><creator>Lee, Chien-Liang ; Chang, Kun-Chuan ; Syu, Ciou-Mei</creator><creatorcontrib>Lee, Chien-Liang ; Chang, Kun-Chuan ; Syu, Ciou-Mei</creatorcontrib><description>[Display omitted]
► Conductive lines are successfully fabricated by printing Ag nanoplates and baking at 100
°C. ► Sintering on these nanoplates at 100
°C led to the formation of connections. ► The resistivity of the line obtained by printing nanoplates is 26.3
μΩ-cm.
Conductive patterns on a flexible polyimide film using Ag nanoplate ink of 10
wt% solid content were successfully fabricated by inkjet printing and baking at a low temperature of 100
°C. Sintering on these printed nanoplates at a low temperature (100
°C) led to the formation of connections between nanoplates. A four-point probe measurement indicated that the resistivity of the line obtained by printing nanoplates is 26.3
μΩ-cm and this is lower than that of the line obtained by printing spherical nanoparticles, 4.3
×
10
5
μΩ-cm.</description><identifier>ISSN: 0927-7757</identifier><identifier>EISSN: 1873-4359</identifier><identifier>DOI: 10.1016/j.colsurfa.2011.03.034</identifier><language>eng</language><publisher>Elsevier B.V</publisher><subject>Baking ; colloids ; Electroless ; Inkjet printing ; Nanocomposites ; Nanomaterials ; Nanoparticle ; Nanoparticles ; Nanostructure ; Printing ; Silver ; Sintering ; temperature</subject><ispartof>Colloids and surfaces. A, Physicochemical and engineering aspects, 2011-05, Vol.381 (1), p.85-91</ispartof><rights>2011 Elsevier B.V.</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c283t-f3c2db797288ba20500b5a72b0b5c64c0015cfa63d0eb2fb178943bb6f24060e3</citedby><cites>FETCH-LOGICAL-c283t-f3c2db797288ba20500b5a72b0b5c64c0015cfa63d0eb2fb178943bb6f24060e3</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>314,780,784,27923,27924</link.rule.ids></links><search><creatorcontrib>Lee, Chien-Liang</creatorcontrib><creatorcontrib>Chang, Kun-Chuan</creatorcontrib><creatorcontrib>Syu, Ciou-Mei</creatorcontrib><title>Silver nanoplates as inkjet ink particles for metallization at a low baking temperature of 100 °C</title><title>Colloids and surfaces. A, Physicochemical and engineering aspects</title><description>[Display omitted]
► Conductive lines are successfully fabricated by printing Ag nanoplates and baking at 100
°C. ► Sintering on these nanoplates at 100
°C led to the formation of connections. ► The resistivity of the line obtained by printing nanoplates is 26.3
μΩ-cm.
Conductive patterns on a flexible polyimide film using Ag nanoplate ink of 10
wt% solid content were successfully fabricated by inkjet printing and baking at a low temperature of 100
°C. Sintering on these printed nanoplates at a low temperature (100
°C) led to the formation of connections between nanoplates. A four-point probe measurement indicated that the resistivity of the line obtained by printing nanoplates is 26.3
μΩ-cm and this is lower than that of the line obtained by printing spherical nanoparticles, 4.3
×
10
5
μΩ-cm.</description><subject>Baking</subject><subject>colloids</subject><subject>Electroless</subject><subject>Inkjet printing</subject><subject>Nanocomposites</subject><subject>Nanomaterials</subject><subject>Nanoparticle</subject><subject>Nanoparticles</subject><subject>Nanostructure</subject><subject>Printing</subject><subject>Silver</subject><subject>Sintering</subject><subject>temperature</subject><issn>0927-7757</issn><issn>1873-4359</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2011</creationdate><recordtype>article</recordtype><recordid>eNqFkN2KFDEQhYMoOK6-gubOqx4rSXen-04Z_IMFL9a9DpVMZclsptMmmRV9Kp_BJzPD6LVQcKD4Tv0cxl4K2AoQ45vD1qVYTtnjVoIQW1Ct-kdsIyatul4N82O2gVnqTutBP2XPSjkAQD_oecPsTYgPlPmCS1ojViocCw_L_YHqWfiKuQYXW9-nzI9UMcbwE2tIC8fKkcf0nVu8D8sdr3RcKWM9ZeLJcwHAf__aPWdPPMZCL_7qFbv98P7r7lN3_eXj5927687JSdXOKyf3Vs9aTpNFCQOAHVBL28SNvQMQg_M4qj2Qld4KPc29snb0socRSF2x15e5a07fTlSqOYbiKEZcKJ2KmSYYhxnmuZHjhXQ5lZLJmzWHI-YfRoA5Z2oO5l-m5pypAdWqb8ZXF6PHZPAuh2JubxrQbhVayOFMvL0Q1D59CJRNcYEWR_uQyVWzT-F_S_4A1t-NnA</recordid><startdate>20110520</startdate><enddate>20110520</enddate><creator>Lee, Chien-Liang</creator><creator>Chang, Kun-Chuan</creator><creator>Syu, Ciou-Mei</creator><general>Elsevier B.V</general><scope>FBQ</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7U5</scope><scope>8FD</scope><scope>L7M</scope></search><sort><creationdate>20110520</creationdate><title>Silver nanoplates as inkjet ink particles for metallization at a low baking temperature of 100 °C</title><author>Lee, Chien-Liang ; Chang, Kun-Chuan ; Syu, Ciou-Mei</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c283t-f3c2db797288ba20500b5a72b0b5c64c0015cfa63d0eb2fb178943bb6f24060e3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2011</creationdate><topic>Baking</topic><topic>colloids</topic><topic>Electroless</topic><topic>Inkjet printing</topic><topic>Nanocomposites</topic><topic>Nanomaterials</topic><topic>Nanoparticle</topic><topic>Nanoparticles</topic><topic>Nanostructure</topic><topic>Printing</topic><topic>Silver</topic><topic>Sintering</topic><topic>temperature</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Lee, Chien-Liang</creatorcontrib><creatorcontrib>Chang, Kun-Chuan</creatorcontrib><creatorcontrib>Syu, Ciou-Mei</creatorcontrib><collection>AGRIS</collection><collection>CrossRef</collection><collection>Solid State and Superconductivity Abstracts</collection><collection>Technology Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><jtitle>Colloids and surfaces. A, Physicochemical and engineering aspects</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Lee, Chien-Liang</au><au>Chang, Kun-Chuan</au><au>Syu, Ciou-Mei</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Silver nanoplates as inkjet ink particles for metallization at a low baking temperature of 100 °C</atitle><jtitle>Colloids and surfaces. A, Physicochemical and engineering aspects</jtitle><date>2011-05-20</date><risdate>2011</risdate><volume>381</volume><issue>1</issue><spage>85</spage><epage>91</epage><pages>85-91</pages><issn>0927-7757</issn><eissn>1873-4359</eissn><abstract>[Display omitted]
► Conductive lines are successfully fabricated by printing Ag nanoplates and baking at 100
°C. ► Sintering on these nanoplates at 100
°C led to the formation of connections. ► The resistivity of the line obtained by printing nanoplates is 26.3
μΩ-cm.
Conductive patterns on a flexible polyimide film using Ag nanoplate ink of 10
wt% solid content were successfully fabricated by inkjet printing and baking at a low temperature of 100
°C. Sintering on these printed nanoplates at a low temperature (100
°C) led to the formation of connections between nanoplates. A four-point probe measurement indicated that the resistivity of the line obtained by printing nanoplates is 26.3
μΩ-cm and this is lower than that of the line obtained by printing spherical nanoparticles, 4.3
×
10
5
μΩ-cm.</abstract><pub>Elsevier B.V</pub><doi>10.1016/j.colsurfa.2011.03.034</doi><tpages>7</tpages></addata></record> |
| fulltext | fulltext |
| identifier | ISSN: 0927-7757 |
| ispartof | Colloids and surfaces. A, Physicochemical and engineering aspects, 2011-05, Vol.381 (1), p.85-91 |
| issn | 0927-7757 1873-4359 |
| language | eng |
| recordid | cdi_proquest_miscellaneous_880659099 |
| source | Elsevier |
| subjects | Baking colloids Electroless Inkjet printing Nanocomposites Nanomaterials Nanoparticle Nanoparticles Nanostructure Printing Silver Sintering temperature |
| title | Silver nanoplates as inkjet ink particles for metallization at a low baking temperature of 100 °C |
| url | http://sfxeu10.hosted.exlibrisgroup.com/loughborough?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-08T16%3A32%3A58IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_cross&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Silver%20nanoplates%20as%20inkjet%20ink%20particles%20for%20metallization%20at%20a%20low%20baking%20temperature%20of%20100%20%C2%B0C&rft.jtitle=Colloids%20and%20surfaces.%20A,%20Physicochemical%20and%20engineering%20aspects&rft.au=Lee,%20Chien-Liang&rft.date=2011-05-20&rft.volume=381&rft.issue=1&rft.spage=85&rft.epage=91&rft.pages=85-91&rft.issn=0927-7757&rft.eissn=1873-4359&rft_id=info:doi/10.1016/j.colsurfa.2011.03.034&rft_dat=%3Cproquest_cross%3E880659099%3C/proquest_cross%3E%3Cgrp_id%3Ecdi_FETCH-LOGICAL-c283t-f3c2db797288ba20500b5a72b0b5c64c0015cfa63d0eb2fb178943bb6f24060e3%3C/grp_id%3E%3Coa%3E%3C/oa%3E%3Curl%3E%3C/url%3E&rft_id=info:oai/&rft_pqid=880659099&rft_id=info:pmid/&rfr_iscdi=true |