Extraction of elastic–plastic material properties of thin films through nanoindentaion technique with support of numerical methods

Current developments and trends in microelectronics are focused on thin layers and novel materials. This leads to application of different test and measurement methods, which are capable to measure basic mechanical properties of such materials in micro-scale and nano-scale. The presented paper focus...

Full description

Saved in:
Bibliographic Details
Published in:Microelectronics and reliability 2011-06, Vol.51 (6), p.1046-1053
Main Authors: Dowhań, Łukasz, Wymysłowski, Artur, Janus, Paweł, Ekwińska, Magdalena, Wittler, Olaf
Format: Article
Language:English
Subjects:
Finite element method
Mathematical models
Mechanical properties
Nanocomposites
Nanoindentation
Nanomaterials
Nanostructure
Thin films
Citations: Items that this one cites
Items that cite this one
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:Current developments and trends in microelectronics are focused on thin layers and novel materials. This leads to application of different test and measurement methods, which are capable to measure basic mechanical properties of such materials in micro-scale and nano-scale. The presented paper focuses on an application of the nanoindentation technique to extract the basic elastic and elasto-plastic mechanical properties through numerical approaches. In order to extract the elasto-plastic material data of the investigated thin layers the numerical process was designed. Firstly, the nanoindentation process was prepared as finite-element model (FEM). Then, the results were compared to the measurements and processed by the numerical optimization algorithms.
ISSN:0026-2714
1872-941X
DOI:10.1016/j.microrel.2011.03.009