Plastic deformation behavior analysis of an electrodeposited copper thin film under fatigue loading

This paper presents a method for estimating the fatigue life of an electrodeposited copper film. From fatigue tests at various mean stresses, the monotonic plastic strain (ratcheting strain) was found to be directly related to fatigue damage, and could be used as a measure of the damage. Accordingly...

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Bibliographic Details
Published in:International journal of fatigue 2011-09, Vol.33 (9), p.1175-1181
Main Authors: Hwangbo, Yun, Song, Ji-Ho
Format: Article
Language:English
Subjects:
Applied sciences
Copper
Cross-disciplinary physics: materials science
rheology
Electrodeposited copper thin film
Exact sciences and technology
Fatigue
Fatigue failure
Fatigue life
Fatigue test
Master curve of fatigue life
Materials science
Mechanical properties and methods of testing. Rheology. Fracture mechanics. Tribology
Metallic coatings
Metals. Metallurgy
Methods of deposition of films and coatings
film growth and epitaxy
Monotonic plastic strain (ratcheting strain)
Physics
Plastic deformation
Plastic strain
Production techniques
Ratcheting
Strain
Surface treatment
Thin films
Weibull distribution
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Summary:This paper presents a method for estimating the fatigue life of an electrodeposited copper film. From fatigue tests at various mean stresses, the monotonic plastic strain (ratcheting strain) was found to be directly related to fatigue damage, and could be used as a measure of the damage. Accordingly, in this study, monotonic plastic strain (ratcheting strain) behavior, and hence also fatigue damage, is analyzed via the Weibull distribution function, and the fatigue life of a copper thin film is estimated. In addition, a master curve for the fatigue life of the copper thin film is derived.
ISSN:0142-1123
1879-3452
DOI:10.1016/j.ijfatigue.2011.02.005