Novel concept of composite phase change material wall system for year-round thermal energy savings

A new type of composite wall system incorporating phase change materials (PCMs) was proposed and its potential for air conditioning/heating energy savings in continental temperate climate was evaluated. The novelty of the wall system consists of the fact that two PCM wallboards, impregnated with dif...

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Bibliographic Details
Published in:Energy and buildings 2010-10, Vol.42 (10), p.1759-1772
Main Authors: Diaconu, Bogdan M., Cruceru, Mihai
Format: Article
Language:English
Subjects:
Building simulation
Composite materials
Energy conservation
Energy saving
Heating
Latent heat thermal energy storage
Melting points
Passive building
PCM building materials
Phase change materials
Seasons
Simulation
Thermal insulation
Wallboard
Walls
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Summary:A new type of composite wall system incorporating phase change materials (PCMs) was proposed and its potential for air conditioning/heating energy savings in continental temperate climate was evaluated. The novelty of the wall system consists of the fact that two PCM wallboards, impregnated with different PCMs are used. The structure of the new wall system is that of a three-layer sandwich-type insulating panel with outer layers consisting of PCM wallboards and middle layer conventional thermal insulation. The PCM wallboard layers have different functions: the external layer has a higher value of the PCM melting point and it is active during hot season and the internal layer with a PCM melting point near set point temperature for heating is active during cold season. A year-round simulation of a room built using the new wall system was carried out and the effect of PCM presence into the structure of the wall system was assessed. It was found that the new wall system contributes to annual energy savings and reduces the peak value of the cooling/heating loads. The melting point values for the two PCMs resulting in the highest value of the energy savings were identified.
ISSN:0378-7788
DOI:10.1016/j.enbuild.2010.05.012