Fabrication of Cube-Textured Ni-9%atW Substrate for YBCO Superconducting Wires Using Powder Metallurgy

Sharp cube textured Ni-9%atW alloy substrates were successfully achieved using the powder metallurgy process and gave promise for coated conductor with reduced AC losses and improved mechanical properties. X-ray studies indicated that the newly developed Ni-9%atW alloy substrates have a good out-of-...

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Bibliographic Details
Published in:IEEE transactions on applied superconductivity 2007-06, Vol.17 (2), p.3428-3431
Main Authors: Zhou, Y.X., Ghalsasi, S.V., Hanna, M., Tang, Z.J., Meng, R.L., Salama, K.
Format: Article
Language:English
Subjects:
AC losses
ALLOY DEVELOPMENT
Alloy powders
Applied sciences
Conductors
COPPER OXIDE
CURIE TEMPERATURE
Electric connection. Cables. Wiring
Electrical engineering. Electrical power engineering
Electronics
Exact sciences and technology
Fabrication
Hysteresis
Magnetic hysteresis
Materials
Mechanical factors
MECHANICAL HYSTERESIS
Ni-9%atW alloy substrates
NICKEL ALLOYS (50 TO 99 NI)
Nickel base alloys
Powder metallurgy
POWDER METALLURGY PROCESSES
POWDERS
PREALLOYED POWDERS
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Superconducting devices
Superconducting filaments and wires
Superconducting magnets
SUPERCONDUCTIVITY
Surface texture
Temperature
textured substrate
Various equipment and components
WIRE
Yttrium barium copper oxide
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Description
Summary:Sharp cube textured Ni-9%atW alloy substrates were successfully achieved using the powder metallurgy process and gave promise for coated conductor with reduced AC losses and improved mechanical properties. X-ray studies indicated that the newly developed Ni-9%atW alloy substrates have a good out-of-plane and in-plane orientation with FWHM values about 3.7deg and 7.05deg respectively. Smooth surface as well as fine grains were obtained in the newly developed textured substrate. Curie temperature is suppressed to be 30 K and magnetic hysteretic losses are zero for Ni-9%atW alloy substrates at 77 K.
ISSN:1051-8223
1558-2515
DOI:10.1109/TASC.2007.899486