Power, Thermal, and Reliability Modeling in Nanometer-Scale Microprocessors

System integration and performance requirements are dramatically increasing the power consumptions and power densities of high-performance microprocessors. High power consumption introduces challenges to various aspects of microprocessor and computer system design. It increases the cost of cooling a...

Full description

Saved in:
Bibliographic Details
Published in:IEEE MICRO 2007-05, Vol.27 (3), p.49-62
Main Authors: Brooks, D., Dick, R.P., Joseph, R., Li Shang
Format: Article
Language:English
Subjects:
Batteries
Battery
Computer architecture
Cooling
Density
Design engineering
Design optimization
Electric power
Energy consumption
Microprocessors
modeling of computer architecture
Nanotechnology
Packaging
Packaging design
Power consumption
power models
Power supplies
Power system modeling
Power system reliability
process variation
Reliability
reliability models
thermal analysis
Citations: Items that this one cites
Items that cite this one
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:System integration and performance requirements are dramatically increasing the power consumptions and power densities of high-performance microprocessors. High power consumption introduces challenges to various aspects of microprocessor and computer system design. It increases the cost of cooling and packaging design, reduces system reliability, complicates power supply circuitry design, and reduces battery life. Researchers have recently dedicated intensive effort to power-related design problems. Modeling is the essential first step toward design optimization. In this article, the power, thermal and reliability modeling problems are explained and recent advances in their accurate and efficient analysis are surveyed.
ISSN:0272-1732
1937-4143
DOI:10.1109/MM.2007.58