Experimental pool boiling investigations of FC-72 on silicon with artificial cavities and integrated temperature microsensors

• Published in: Experimental thermal and fluid science 2010-05, Vol.34 (4), p.422-433
• Main Authors: Hutter, C., Kenning, D.B.R., Sefiane, K., Karayiannis, T.G., Lin, H., Cummins, G., Walton, A.J.
• Format: Article
• Language: English
• Subjects: Applied sciences; Artificial cavities; Boiling; Bubbles; Chips; Design. Technologies. Operation analysis. Testing; Electronics; Exact sciences and technology; Holes; Integrated circuits; Mouth; Nucleation; Pool boiling; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices; Silicon; Walls
• ISSN: 0894-1777; 1879-2286
• DOI: 10.1016/j.expthermflusci.2009.03.010

In this experimental study, fluorinert FC-72 is boiled on a silicon chip with artificial cavities and integrated microsensors. The horizontal silicon chip with dimensions of 39.5 × 19 × 0.38 mm is completely immersed in FC-72. The integrated nickel–titanium temperature microsensors on the back of the chip are calibrated individually and exhibit a near-linear increase of electrical resistance with temperature. The applied heat fluxes and the resulting wall superheat at the boiling surface are varied by means of an integral thin-film resistance heater (95% Al, 4% Cu and 1% Si), also on the back of the silicon chip. Artificial cylindrical cavities with a mouth diameter of 10 μm and depths of 40, 80 or 100 μm situated above the microthermometers serve as artificial nucleation sites, due to trapped vapour. Bubble growth rates, frequencies, departure diameters of bubbles and waiting times between bubbles from an isolated cavity for different wall superheats and pressures were obtained by analysing high-speed video images and the simultaneously measured temperature below the artificial cavity.