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Barrier and seed repair performance of thin RuTa films for Cu interconnects

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Bibliographic Details
Published in:	Microelectronic engineering 2011-05, Vol.88 (5), p.690-693
Main Authors:	Volders, H., Carbonell, L., Heylen, N., Kellens, K., Zhao, C., Marrant, K., Faelens, G., Conard, T., Parmentier, B., Steenbergen, J., Peer, M. Van de, Wilson, C.J., Sleeckx, E., Beyer, G.P., Tőkei, Zs, Gravey, V., Shah, K., Cockburn, A.
Format:	Article
Language:	English
Subjects:	Annealing Applied sciences Barrier properties Barriers Cold working, work hardening annealing, quenching, tempering, recovery, and recrystallization textures Copper Cross-disciplinary physics: materials science rheology Design. Technologies. Operation analysis. Testing Electronics Exact sciences and technology Heat treatment Integrated circuits Integrity Materials science Metals. Metallurgy Methods of deposition of films and coatings film growth and epitaxy Narrow lines Physical vapor deposition Physics Production techniques RuTa Seed enhancement Seeds Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Tantalum Thin films Treatment of materials and its effects on microstructure and properties Trenches Vapor phase epitaxy growth from vapor phase
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